CP2-SB095-G1-FJ

Series:	MetPak™ CP2
Packaging:	Bulk
Lead Free Status / RoHS Status:	--
Part Status:	Active
Moisture Sensitivity Level (MSL):	--
Connector Type:	Receptacle, Female Sockets
Connector Style:	B 19
Number of Positions:	95
Number of Positions Loaded:	All
Pitch:	0.079" (2.00mm)
Number of Rows:	5
Mounting Type:	Through Hole, Right Angle
Termination:	Press-Fit
Connector Usage:	CompactPCI
Contact Finish:	Gold
Contact Finish Thickness:	10.0µin (0.25µm)
Voltage Rating:	--
Operating Temperature:	-55°C ~ 125°C
Features:	Upper Shield

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Introduction

Backplane connectors are an integral part of circuit boards. Whether traditional hard metric or the more popular Standard connectors, these connectors are used to link two different boards together for the purpose of transmitting signals, data, and power in a wide variety of applications. This article will focus on the CP2 SB095-G1-FJ backplane connectors and examine their application field and working principle.

Application Field

The CP2 SB095-G1-FJ series of backplane connectors are designed for use in various high-speed networking, telecommunications, and storage applications. These types of connectors are often used as an bulkhead jack on the back side of motherboards for both in-chassis or external connections. Other applications of this type of connector include industrial external network connections, Point-to-Multipoint communication systems, and Supercomputer applications.

Product Features and Benefits

The CP2 SB095-G1-FJ series of backplane connectors is designed with a number of features and benefits that make it an ideal choice for many types of applications. This series offers excellent signal and power integrity, low insertion and extraction force, and positive detent and latching. The product can also be used for switching at 5 Gb/s and beyond, and it is fully compliant with the PICMG 2.20 Ethernet Standard.

Working Principle

The CP2 SB095-G1-FJ series of backplane connectors utilizes a multi-layer printed circuit board stackup to achieve its excellent signal and power integrity. This type of stackup eliminates impedance changes which can be caused by various board-to-board interfaces. The connectors also feature two rows of ground vias that combine to form a solid ground plane, drastically reducing cross talk and EMI/RF emissions. The connectors also make use of impedance-controlled single-ended traces which have been designed to minimize transmission line reflections. This helps to ensure the highest signal integrity possible and reduces the risk of data errors. The connectors also feature a unique pin-in-paste connector contact system which allows for reliable connection in high vibration applications.

Conclusion

The CP2 SB095-G1-FJ series of backplane connector is a reliable, cost-effective solution for high-speed networking, telecommunications, and storage applications. It is designed with a number of features and benefits such as low insertion and extraction forces, positive detent and latching, excellent signal and power integrity, and high-vibration resistance. The series also utilizes a multi-layer printed circuit board stackup and impedance-controlled single-ended traces to ensure the highest signal integrity possible.

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