DF12(3.0)-80DP-0.5V(86)

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The DF12(3.0)-80DP-0.5V(86) is an array-style, edge-type modular connector typically used for mezzanine or board-to-board applications. It is offered in surface mount in multiple configuration options and as both a right angle and vertical mount. It also has a low profile for added flexibility in design.

The DF12(3.0)-80DP-0.5V(86) has a switch on each of its 80 pins, which makes it ideal for high-density interconnection applications, such as backplane and Power over Ethernet (PoE). It is also backwards compatible with previous DF12 generations, allowing designers to easily migrate from an older version to the new one.

The DF12(3.0)-80DP-0.5V(86) is designed to meet the higher signal integrity demands of modern designs. It uses a standard pinout array with an industry-standard pitch of 0.5mm, making it compatible with a wide variety of cable, board, and other wire harnessing systems. The connector is highly durable, featuring a reliable friction lock system and a secure connection.

The DF12(3.0)-80DP-0.5V(86) has a wide range of applications. Its small size and low profile make it suitable for high-density applications such as communications equipment and industrial control systems. It can also be used for applications that require improved signal integrity, such as automotive, medical, and general consumer electronics. Its ability to provide a secure connection also makes it ideal for use in applications that require vibration resistance, such as hand-held or portable electronic devices.

The working principle of the DF12(3.0)-80DP-0.5V(86) is simple. It uses a standard pin layout, and the signal pairs are connected to the board through solder points, with each signal pair connected to an independent ground point. The integrated “lock” mechanism on the housing is designed to hold the connector in place and provide a reliable secure connection. The HFDS technology inside the connector helps to reduce crosstalk and increase the signal integrity.

The DF12(3.0)-80DP-0.5V(86) provides a dependable and reliable connection solution in a wide range of applications. Its low profile and high-density pinouts make it an ideal choice for high-density interconnection applications. The combination of the integrated “lock” mechanism and HFDS technology ensures that the user will have a secure connection and improved signal integrity.

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