DF15(1.8)-50DS-0.65V(56)

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DF15(1.8)-50DS-0.65V(56) edge type, mezzanine (board to board) connectors are a small form factor, low profile connector developed by Molex. The combination of their small size and advanced features allow for a wide range of applications, from cell phones and digital cameras to industrial robotics and medical imaging.

The DF15 series connector is a compact two-piece connector that offers the advantages of an edge connector design in a small form factor. It allows for a high connection density with an exceptionally small mounting height of only 0.65mm. The two-piece design provides a low mating force, which reduces the risk of damage to the board and connector when mating or unmating. DF15 connectors are polarized with polarizing nipples and locating notches, so that the correct mating orientation is achieved.

The DF15 series connectors are available in 50-pin configurations, with high-speed and power capabilities, and have a current rating of up to 3A. The connector assembly features a dual beam contact design with a self-aligning feature that ensures positive mating and a good electrical connection. The center portion is designed such that it will ensure a reliable connection even in the presence of vibration and shock.

The DF15 series is low profile and allows for secure stackability of a number of PCBs in compact spaces. It has a low profile and high density, a wide range of mating heights, a polarizing design, and self-mating features, all of which make the DF15 ideal for applications in a variety of industries. It is also easy to integrate into automated assembly lines, as it offers good solder video and good resistance to manufacturing stresses.

The DF15 series connector is a great solution for many types of applications such as cellular phones, digital cameras, industrial robotics, medical imaging, and others. They offer the highest degree of flexibility in a compact size and are available in our inventory at highly competitive prices. We recommend the DF15 for applications which require high-density, low profile, and miniaturization.

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