DF37C-30DS-0.4V(51)

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Rectangular Connectors - Arrays, Edge Type, Mezzanine (Board-to-Board) is home to many different connector types that are specially designed for a variety of applications. One of these connectors is the DF37C-30DS-0.4V(51). This connector type is a mezzanine board-to-board connector, which offers a complete board-to-board interconnect solution with various size and terminal spacing options. This connector is particularly convenient in applications which require a greater number of electrical contacts, as it allows for high-density stackable interconnects.

The DF37C-30DS-0.4V(51) comes in a double row form built for board-to-board couplings. It comes with contacts spaced 0.4 millimeters apart, and is intended for interconnector applications on 0.08 millimeters thick PCBs. The pins are arranged in a staggered formation which provides the connector a total of 30 pins. The DF37C-30DS-0.4V(51) has a 0.5 millimeter pitch spacing. It is made with a gold-plated copper alloy to provide high-performance signal transmission and good heat dissipation.

The DF37C-30DS-0.4V(51) is designed with two mated parts that fit perfectly into one another. To mate these two parts, they must first be tightened with a specific screw set. A locking jack is then placed between the pairs of mating connectors to ensure the connection is secure. Once the connectors are mated, they are soldered in place. This ensures a good electrical contact is maintained and reduces the risk of electrical disconnect.

This board-to-board connector is mainly used in applications that require integration of multiple electrical contacts in a small spacing. This makes it a great choice in applications where saving space is desired. It has a wide range of applications such as audio equipment, power supplies, medical devices, computers, and more. This connector type is also rated for -20 to +85 degrees Celsius, making it suitable for operation and storage in many harsh environments. With its combination of a small size, reliable performance, and high-temperature operating capacity, the DF37C-30DS-0.4V(51) is an ideal connector choice for board-to-board interconnects.

The DF37C-30DS-0.4V(51) is an innovative solution for high-density board-to-board connections. Its small size and wide range of applications make it an effective tool for a variety of industries and electronics. Its gold-plated copper alloy construction helps ensure high performance signal transmission and good heat dissipation, helping deliver reliable connections and reduce failure in many applications.

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