DF40HC(3.0)-30DS-0.4V(58)

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The DF40HC (3.0)-30DS-0.4V (58) is one of the various types of rectangular connectors, and is an array, edge type, mezzanine (board to board). It has a genderless design and is characterized by its 0.4 mm pitch. One of the major features of these connectors is its small size, enhancing its convenience in various applications.

The DF40HC (3.0)-30DS-0.4V (58) suits a large range of applications. It is mostly used in high-speed transmission of signals that require many pins. It is frequently utilized for circuit boards, allowing for flexible interconnectivity. It is also widely used in handheld devices and consumer electronics, due to its portability and practicality. Furthermore, it can also be employed for industrial automation and communication systems, making it a common choice in many industries.

In terms of its construction, the DF40HC (3.0)-30DS-0.4V (58) contains a surface-mount housing which allows for easy installation. It also consists of two rows of 15 independent contacts, with each pin connected on two opposing rows of the board. Furthermore, it is equipped with a secure latching system that ensures reliable and consistent contact positioning when mated.

The DF40HC (3.0)-30DS-0.4V (58) works by providing an electrical connection between two printed circuit boards. When the two boards are mated together, the contacts are pressed against each other to form an electrical bridge. The contact force between the two contacts allows for a secure and reliable data transfer. In addition, the mating force exerted on the contacts also helps to prevent any potential disconnection or signal interruption.

The DF40HC (3.0)-30DS-0.4V (58) is highly secure and reliable due to its considerable contact force. Furthermore, it is also highly durable, and is capable of withstanding harsh environmental conditions such heat, corrosion and vibration. As such, it has become a popular choice in various industries, ranging from consumer electronics to industrial automation. Its small size and versatile applications make it an ideal solution for modern interconnectivity needs.

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