DF9-23P-1V(54)

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DF9-23P-1V(54) is a type of rectangular connector within the array, edge type, and mezzanine (board to board) categories. It boasts a 0.36” pitch size and an array of 10 pins with one row of 9 pins and one separate row of 13 pins. It is available in both standard and reverse versions and comes in a variety of colors. The DF9-23P-1V(54) is a compact design, allowing for easy installation and assembly.

The primary application of the DF9-23P-1V(54) is in a wide variety of power and signal applications. It is commonly used in high density applications such as motherboards and other computing equipment, as well as in consumer grade electronics and communication devices. This connector is designed with a high temperature range, making it suitable for both high heat and cold environments.

In terms of its working principle, the DF9-23P-1V(54) connector operates on a circuit board basis. A circuit board is the basis on which electrical connections are made with electrical components. In the case of the DF9-23P-1V(54), the pins on the connector are arranged on the board to create an electrical pathway. When power is applied to the connector, electricity flows through this pathway to enable data communication or power transfer.

The DF9-23P-1V(54) is also known for its superior performance. It is able to perform at a higher voltage rating than many other types of connectors and has long lasting strength, durability, reliability, and maximum heat dissipation. Furthermore, the connector has a low profile, which makes it a more user-friendly option, as it is easier to assemble and connect. Finally, the DF9-23P-1V(54) connector is resistant to shock and vibration, making it suitable for a wide variety of applications.

Overall, the DF9-23P-1V(54) is a reliable and versatile connector within the rectangular connector array, edge type, and mezzanine (board to board) categories. Its optimal high temperature range and superior performance make it a top choice for many types of power and signal applications, including high-density motherboards, consumer grade electronics, communication devices, and more. Its flexibility, durability, and reliability make it an ideal choice for a wide range of applications.

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