DF9-9P-1V(32)

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The DF9-9P-1V(32) connector type is a rectangular array of pins housed in a mezzanine board-to-board connector system. Mezzanine connectors are commonly used for a variety of applications, and the DF9-9P-1V(32) type is particularly suited for high-speed communication needs. In this article, we\'ll explore the application field and working principle of this precise connector type.

Application Field

The DF9-9P-1V(32) mezzanine connector is typically used for the interconnection of two mating circuit boards. Because of its small size, the DF9-9P-1V(32) is well-suited for space-constrained application areas such as control boxes, robotics or instrumentation. It\'s also commonly used in power, signal and data transmission systems in the telecom, military, aerospace, medical, consumer electronics and automotive industries. Because of its high-speed characteristics, it\'s found in applications requiring higher data rates than the previous generation of mezzanine connectors.

Working Principle

The DF9-9P-1V(32) mezzanine connector system is equipped with a high-density hybrid array pin pattern of 32 pins and operates at up to 5.0 Gbps data rate. The DF9-9P-1V(32) uses a 7-row and 7-col array of contacts and a 0.65 mm pitch size for the contact array. The small pitch size allows the connector to be used in space-constrained application areas, while the array enables the connector to be used for high-speed communication. Each row of contacts consists of two ground pins, two differential signal pairs (transmit and receive) and one supply voltage or key pin.

The edge-type design with a 1mm panel-slot enables a secure connection with minimal board space requirements. The board-to-board mechanism prevents misalignment and guarantees a proper contact engagement and disengagement. When the mating occurs, the socket contacts of the DF9-9P-1V(32) connector system are pushed down to make contact with the pins of the mating connector. After the mating is completed, the two boards are securely locked in place and the electrical connections are completed.

The DF9-9P-1V(32) connector system also features a low-profile lid with built-in shielding to help suppress EMI and reduce signal crosstalk between adjacent pins and connectors. The low-profile shield also prevents dust, dirt and other contaminants from entering the mating area which can lead to failure of system operation. Additionally, the DF9-9P-1V(32) features an integrated locking latch which helps to ensure that the connection between the two mating boards is properly secured during use.

Conclusion

In conclusion, the DF9-9P-1V(32) mezzanine connector system is an ideal choice for high-speed communication needs in a variety of application areas. Its high-density hybrid array pin pattern, edge-type design and integrated locking latch provide a secure connection and minimal board space requirements. Additionally, its low-profile lid with built-in shielding helps to suppress EMI and reduce signal crosstalk between adjacent pins and connectors. The DF9-9P-1V(32) connector system is well suited for fast data transfer in power, signal and data transmission systems in the telecom, military, aerospace, medical, consumer electronics and automotive industries.

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