DPAM-23-11.0-S-8-2-A

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Rectangular Connectors - Arrays, Edge Type, Mezzanine (Board to Board) are connectors that are used in many different applications. In this article, we will discuss the application field and working principle of the DPAM-23-11.0-S-8-2-A connector.

The DPAM-23-11.0-S-8-2-A connector is a mezzanine type board to board connector which is used in high density applications. It features a 2mm contact-to-contact pitch and 1mm row to row spacing that allows this connector to be used to create a very dense board to board configuration. It also features a 0.6mm contact-to-row spacing that enables the connector to be mounted directly on to semiconductor chips.

This type of connector is used in a variety of applications. They are used in industrial, consumer, and medical applications. They are also used in robotic systems and in communications applications. The DPAM-23-11.0-S-8-2-A connector has been specifically designed for use in high density applications where the pitch and spacing are very important.

The working principle of the DPAM-23-11.0-S-8-2-A connector is fairly simple. It is an array of contacts that have a 2mm spacing between them. The contacts are connected to a row socket connector or PCBs, with the sockets being used to hold the contacts in place. When in use, two rows of contacts can be connected together via the sockets, forming a row-to-row connection. This connection allows a secure and reliable electrical connection between the two components.

The DPAM-23-11.0-S-8-2-A connector is also designed with an energy-saving feature. This connector uses a dielectric material that has a high dielectric constant and low dielectric loss properties. This reduces power dissipation significantly, making the connector more energy efficient.

The DPAM-23-11.0-S-8-2-A connector is also designed for high-speed transfer and signal transmission. The contacts feature a gold plating which ensures low contact resistance and a strong signal integrity. This allows for high-speed data rates up to 25Gbps.

In conclusion, the DPAM-23-11.0-S-8-2-A connector is a board to board mezzanine-style connector that is designed for high density applications. It features a 2mm contact-to-contact pitch and 1mm row to row spacing that allows for dense configurations. It is also energy efficient, as it uses a dielectric material with a high dielectric constant and low loss properties. Finally, it features a gold plating that provides low contact resistances and a strong signal integrity, allowing for high-speed data rates up to 25Gbps.

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