ER8-100P-0.8SV-5H

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ER8-100P-0.8SV-5H is a type of rectangular connectors - arrays, edge type, mezzanine with a connector pitch of 0.8mm to 4.2mm. It typically offers 100 poles in two rows; 8 signal rows each with 50 contacts with a reliable, durable and low-profile 1.25mm mounting pitch. The connector is designed to feature a standard double row pitch, and is suitable for board-to-board connections.

The ER8-100P-0.8SV-5H’s double-row vertical design has a cross-section as small as 1.25mm. The vertical layout minimizes the area taken up by this type of connector. This is because the contact-to-contact spacing is minimized and only the rear of the contact is visible. The reduction in the area needed reduces the cost of the component and provides a competitive advantage to the user. Because the ER8-100P-0.8SV-5H has a compact design, it is suitable for applications that require internal connections between boards.

The ER8-100P-0.8SV-5H mezzanine connector utilizes high-reliability, high-frequency signal electrical and mechanical performance matched with many of Molex’s low profile designs. Contacts are available on a 0.8mm pitch, with an optimized tail section providing greater solder joint strength. The vertical contact design provides higher stability and better shielding performance. The ER8-100P-0.8SV-5H connector can be used in applications that require a miniature form factor such as mobile devices, cloud computing, virtualization, thin clients, and industrial rigs and automation. It is also widely used in the medical and automotive electronics industries.

The ER8-100P-0.8SV-5H’s edge design helps to minimize height and helps to keep out dust and liquids. The connector also features a robust solder joint reduction on the tail section, allowing for miniaturization while maintaining reliable and durable interconnects. Additionally, the low-profile contact system reduces PCB layout and assembly complexity with its two-part design.

The ER8-100P-0.8SV-5H mezzanine connector is designed to deliver excellent performance in low-profile board-to-board connections in various applications. These applications include medical and automotive components, and small form factor designs. The connector features high-frequency performance and high-reliability with a reliable, durable and low-profile 1.25mm mounting pitch. In addition, its double-row vertical design minimizes the area taken up by the connector, making it suitable for small and compact designs. It can also be used in applications that require internal connections between boards, with its robust solder joint reduction on the tail section.

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