ERM8-010-05.0-S-DV-EGPS-TR

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The ERM8-010-05.0-S-DV-EGPS-TR belongs to the rectangular connectors - arrays, edge type, mezzanine (board to board) category. This rectangular mezzanine connector is designed to provide simple and reliable means for the connection of two printed circuit boards requiring up to 10 positions in a staggered and right angle connection.

Typically used in a variety of applications, including power supplies, automotive, communications, audio/visual components, consumer electronics, and medical applications, the ERM8-010-05.0-S-DV-EGPS-TR connector is reliable and durable.

The ERM8-010-05.0-S-DV-EGPS-TR operates by having a printed circuit board, which is mounted on plastic or metal housing and plugged into a mating receptacle on the second board. The contact pins are soldered to the board with gold-plated contacts providing low contact resistance and high durability.

The ERM8-010-05.0-S-DV-EGPS-TR connector also features an integral shielding disk, which improves contact reliability by providing RF shielding to avoid crosstalk. It also has a damped vibration absorption system that helps to reduce the mechanical and electrical effects of vibration and shock. This helps extend the life of the connector and increase its reliability.

The ERM8-010-05.0-S-DV-EGPS-TR connector has a 2 mm pitch, 2.5 mm mated height and a maximum current rating of 1 A. It has an operating temperature range of -20°C to +105°C and is able to withstand a shock of 30 Gs and vibration of 10 Gs at 100 Hz. The contact retention force is 87N and a dielectric withstanding voltage of 1000 VAC. It is RoHS compliant and has a UL-recognized component file number.

The ERM8-010-05.0-S-DV-EGPS-TR connector can be used in a variety of applications, including power supplies, automotive, communications, audio/visual components, consumer electronics, and medical applications. It provides a reliable connection with low contact resistance and offers protection against shock, vibration, and crosstalk, making it an ideal choice for these applications.

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