ESQT-110-02-F-D-383

The ESQT-110-02-F-D-383 is a rectangular connector header from a series manufactured by Metalink Technologies. It’s a low-profile, two-row, open-style, board-to-board design with four mounting holes. This header is constructed from a combination of metal and thermoplastic, providing robustness, environmental protection, and enhanced power transfer. It also features high-temperature soldering with reflow stability.

Features:

• Compatible with a wide range of standard connectors
• 4 mm pitch size and two row design
• Open-style board-to-board structure
• Board-to-board and board-to-cable connection
• High-temperature solder and reflow stability
• Robust construction
• Thermoplastic insulator
• Copper alloy electrical contacts

Applications:

The ESQT-110-02-F-D-383 is primarily used in board-to-board applications such as the connection between two PCBs in the same device. It’s also used in board-to-cable applications such as the connection between a single PCB and a cable. Common applications include medical and laboratory devices, automotive, machine control, and industrial applications.

Working Principle:

The ESQT-110-02-F-D-383 has four mounting holes that allow for the secure mounting of the header to a PCB. Once secured, the pins are welded to the PCB and the header is connected via suitable female connectors. The Electrical Contacts of the ESQT-110-02-F-D-383, provide high-power transfer performance while ensuring reliable contact between the pins of the header and the female contacts. The thermoplastic insulator encasing the contacts provides effective insulation and protection for the pins while the robust construction provides durability, protection from shock, and vibration resistance.

Conclusion:

The ESQT-110-02-F-D-383 is a rectangular connector header from the series manufactured by Metalink Technologies. It has a two-row open-style board-to-board design and is suitable for board-to-board and board-to-cable connections. The high-temperature solder reflow and robust construction make it a reliable and durable solution for high-power transfer applications such as those found in medical and laboratory devices, automotive, machine control, and industrial contexts.