ESQT-118-02-MM-Q-309 Allicdata Electronics
Allicdata Part #:

ESQT-118-02-MM-Q-309-ND

Manufacturer Part#:

ESQT-118-02-MM-Q-309

Price: $ 8.14
Product Category:

Connectors, Interconnects

Manufacturer: Samtec Inc.
Short Description: ELEVATED 2MM SOCKETS
More Detail: 72 Position Elevated Socket Connector Through Hol...
DataSheet: ESQT-118-02-MM-Q-309 datasheetESQT-118-02-MM-Q-309 Datasheet/PDF
Quantity: 1000
1 +: $ 7.32690
Stock 1000Can Ship Immediately
$ 8.14
Specifications
Insulation Color: Black
Contact Finish Thickness - Post: --
Contact Material: Phosphor Bronze
Contact Shape: Square
Insulation Material: Liquid Crystal Polymer (LCP)
Applications: --
Voltage Rating: --
Current Rating: 4.5A per Contact
Features: --
Ingress Protection: --
Mated Stacking Heights: --
Contact Finish - Post: Tin
Material Flammability Rating: UL94 V-0
Operating Temperature: -55°C ~ 125°C
Contact Length - Post: 0.541" (13.74mm)
Insulation Height: 0.309" (7.85mm)
Series: ESQT
Contact Finish Thickness - Mating: 20.0µin (0.51µm)
Contact Finish - Mating: Gold
Fastening Type: Push-Pull
Termination: Solder
Mounting Type: Through Hole
Row Spacing - Mating: 0.079" (2.00mm)
Number of Rows: 4
Pitch - Mating: 0.079" (2.00mm)
Number of Positions Loaded: All
Number of Positions: 72
Style: Board to Board or Cable
Contact Type: Forked
Connector Type: Elevated Socket
Part Status: Active
Packaging: Bulk 
Description

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Rectangular connectors are essential components for many differnt applications, and ESQT-118-02-MM-Q-309 connectors are a type of rectangular connectors specially designed for special applications that require a smaller form factor. ESQT-118-02-MM-Q-309 connectors are commonly used in a variety of consumer electronics and industrial computer applications.

The ESQT-118-02-MM-Q-309 connector is a type of header, receptacle, female socket. It is a two-piece polyamide connector with a 2.54 mm pitch and 2 mm row spacing, and is designed for low-voltage applications such as communication and data transfer applications. The connector features four rows of connections, with two rows of four pins each. The mating header and receptacle parts are available in a variety of colors to meet most signal requirements.

The key features of the ESQT-118-02-MM-Q-309 connector include a small form factor, low-profile design, and a secure lock-and-tilt mounting system for enhanced stability. In addition, the connector features anti-vibration and anti-twist design for improved operability, and is RoHS compliant. The plastic latch and push-lock design of the receptacle ensures a secure connection, and the built-in strain relief on the receptacles helps to reduce the risk of signal loss.

The ESQT-118-02-MM-Q-309 connector is designed to be used in applications that require high-density, low-profile wiring. The connector is most often used in computers, consumer electronics, automotive electronics, and instrumentation. The connector is compatible with all major types of ICs and transceivers, and is suitable for use in datacom, telecom, and control systems.

The working principle of the ESQT-118-02-MM-Q-309 connector is quite simple. When the plug is inserted into the socket, the signal pins on the plug make contact with the corresponding pins in the socket, allowing the signal to be transmitted. The plug is secured in the socket by a locking mechanism, which ensures that the connection remains secure even under vibration or shock. Additionally, the locking mechanism helps to ensure that the signal pins have a good contact with the corresponding pins in the socket.

The ESQT-118-02-MM-Q-309 connector is an ideal solution for applications that require a small form factor, high-density wiring, and robust performance. Its small form factor allows for easy installation in tight spaces, while its locking mechanism ensures a reliable connection. The built-in strain relief on the receptacles provides additional protection from signal loss, and the connector is compatible with all major ICs and transceivers. The ESQT-118-02-MM-Q-309 connector is a good choice for a variety of applications that require a small form factor and high-density, low-profile wiring.

The specific data is subject to PDF, and the above content is for reference

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