ESQT-130-03-F-Q-386 Allicdata Electronics
Allicdata Part #:

ESQT-130-03-F-Q-386-ND

Manufacturer Part#:

ESQT-130-03-F-Q-386

Price: $ 8.34
Product Category:

Connectors, Interconnects

Manufacturer: Samtec Inc.
Short Description: ELEVATED 2MM SOCKETS
More Detail: 120 Position Elevated Socket Connector Through Ho...
DataSheet: ESQT-130-03-F-Q-386 datasheetESQT-130-03-F-Q-386 Datasheet/PDF
Quantity: 1000
1 +: $ 7.50330
Stock 1000Can Ship Immediately
$ 8.34
Specifications
Insulation Color: Black
Contact Finish Thickness - Post: --
Contact Material: Phosphor Bronze
Contact Shape: Square
Insulation Material: Liquid Crystal Polymer (LCP)
Applications: --
Voltage Rating: --
Current Rating: 4.5A per Contact
Features: --
Ingress Protection: --
Mated Stacking Heights: --
Contact Finish - Post: Tin
Material Flammability Rating: UL94 V-0
Operating Temperature: -55°C ~ 125°C
Contact Length - Post: 0.072" (1.83mm)
Insulation Height: 0.386" (9.80mm)
Series: ESQT
Contact Finish Thickness - Mating: 3.00µin (0.076µm)
Contact Finish - Mating: Gold
Fastening Type: Push-Pull
Termination: Solder
Mounting Type: Through Hole
Row Spacing - Mating: 0.079" (2.00mm)
Number of Rows: 4
Pitch - Mating: 0.079" (2.00mm)
Number of Positions Loaded: All
Number of Positions: 120
Style: Board to Board or Cable
Contact Type: Forked
Connector Type: Elevated Socket
Part Status: Active
Packaging: Bulk 
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The ESQT-130-03-F-Q-386 is a component of the Rectangular Connectors family, specifically those categorized as Headers, Receptacles, Female Sockets. This specific connector is designed for applications where a shield-to-board connection is required. The ESQT-130-03-F-Q-386 is shielded, polarized, and with the most common 1:1 mating ratio. In addition, it offers an optimized solution for high speed applications including Ethernet, power over Ethernet, Fibre Channel, urban mass transit, networking, automotive, and medical.

The two most important features of this connector design are the increased signal integrity and the low number of mating cycles required. The contact area on this connector is large enough for a secure connection and the gold plating provides a low contact resistance, thereby achieving precise signal integrity. In addition, the connector is designed to handle a higher number of mating cycles. This is achieved by using a higher grade of stainless steel for the contact, which gives it a higher ductility for an increased number of mating cycles.

The working principle of the ESQT-130-03-F-Q-386 is relatively simple. When a mating connector is inserted, it mechanically pushes the contacts towards each other, creating a connection. The shielding ensures that no electromagnetic radiation is emitted, and thus also prevents interference from outside sources. The gold plating helps to further reduce interference, as it is an effective conductor of electricity in comparison to other metals. Furthermore, the polarization of the connector helps to ensure that the correct pins of the connected electronic components are properly connected to each other.

In addition, the ESQT-130-03-F-Q-386 has a number of other features that make it well-suited for many applications. It has an integrated strain relief and cable retention that improves signal quality as well as guarantees proper fitment and strain relief. It also has a durable plastic housing that provides a secure fitment and helps to protect the connector from any environmental hazards. Lastly, the connector has a snap-in design that allows it to be easily installed and removed, making it very convenient for applications in tight spaces.

Overall, the ESQT-130-03-F-Q-386 connector is a great solution for applications where shield-to-board connection is required. It offers outstanding signal quality, durability, an increased number of mating cycles, and a convenient snap-in design. In addition, its gold plated contacts provide excellent conductivity, as well as low contact resistance. As a result, this is an effective choice for high speed applications such as networking, automotive, and medical.

The specific data is subject to PDF, and the above content is for reference

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