ESQT-149-03-G-6-375 Allicdata Electronics
Allicdata Part #:

ESQT-149-03-G-6-375-ND

Manufacturer Part#:

ESQT-149-03-G-6-375

Price: $ 36.25
Product Category:

Connectors, Interconnects

Manufacturer: Samtec Inc.
Short Description: ELEVATED 2MM SOCKETS
More Detail: 294 Position Elevated Socket Connector Through Ho...
DataSheet: ESQT-149-03-G-6-375 datasheetESQT-149-03-G-6-375 Datasheet/PDF
Quantity: 1000
1 +: $ 32.62770
Stock 1000Can Ship Immediately
$ 36.25
Specifications
Insulation Color: Black
Contact Finish Thickness - Post: 3.00µin (0.076µm)
Contact Material: Phosphor Bronze
Contact Shape: Square
Insulation Material: Liquid Crystal Polymer (LCP)
Applications: --
Voltage Rating: --
Current Rating: 4.5A per Contact
Features: --
Ingress Protection: --
Mated Stacking Heights: --
Contact Finish - Post: Gold
Material Flammability Rating: UL94 V-0
Operating Temperature: -55°C ~ 125°C
Contact Length - Post: 0.083" (2.11mm)
Insulation Height: 0.375" (9.53mm)
Series: ESQT
Contact Finish Thickness - Mating: 20.0µin (0.51µm)
Contact Finish - Mating: Gold
Fastening Type: Push-Pull
Termination: Solder
Mounting Type: Through Hole
Row Spacing - Mating: 0.079" (2.00mm)
Number of Rows: 6
Pitch - Mating: 0.079" (2.00mm)
Number of Positions Loaded: All
Number of Positions: 294
Style: Board to Board or Cable
Contact Type: Forked
Connector Type: Elevated Socket
Part Status: Active
Packaging: Bulk 
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The ESQT-149-03-G-6-375 is a rectangular header and receptacle connector. It is primarily used in electronic equipment and telecommunications devices. Compared to conventional connectors, this type of connector offers superior protection against risks associated with environmental conditions, such as vibrations, shock and EMI. The connector contains two electrical contact systems: a header and a receptacle. The header comprises two parallel solder contacts, while the receptacle consists of two rows of parallel staggered contacts.

The ESQT-149-03-G-6-375 connection system is primarily designed for high-density applications, with pitch sizes of 0.079” and 0.079/0.100”, making it suitable for a wide range of applications such as consumer electronics, computers, automotive, communications, sensors and appliances.

This type of connector is designed with two contact types, alongside a head-on mating feature, which enables a saving in the cost and the number of components required for device connection. It has a secure mechanical connection for dependable contact retention, overrating capability and a low contact resistance. The contact system also has a gold plating in order to ensure reliable electrical contact in harsh environments. Additionally, it has a polarization feature that requires the connector to be plugged-in in the correct orientation.

When establishing a connection using the ESQT-149-03-G-6-375 connector, two mechanisms are employed during the mating process. First, the shape of the connector fits into the socket slots, providing a snug, tight fit. Second, the contacts inside the socket are compressed by the force generated by the plunger in order to make the connection. This tight mechanical fit ensures a secure connection and provides reliable contact retention.

For extractions, a release lever is provided that releases a mechanical lock, thereby allowing a secure connection to be broken. This lock ensures that the connector remains secure when mated and during extractions. Additionally, the headers have a strain relief feature that prevents live cables from being pulled out of the housing. This ensures a more secure connection between the device and the connector.

The ESQT-149-03-G-6-375 connector is suitable for a wide range of applications, such as industrial, consumer, computer, automotive, communications, sensors and appliances. It is extremely versatile as it provides superior protection from environmental conditions such as vibration and shock, and it is resistant to corrosion, dust, and EMI. Additionally, it is designed for high-density applications, and it is easy to install and maintain.

The specific data is subject to PDF, and the above content is for reference

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