| Allicdata Part #: | ESW-112-37-S-S-ND |
| Manufacturer Part#: |
ESW-112-37-S-S |
| Price: | $ 2.09 |
| Product Category: | Connectors, Interconnects |
| Manufacturer: | Samtec Inc. |
| Short Description: | ELEVATED SOCKET STRIPS |
| More Detail: | 12 Position Elevated Socket Connector Through Hol... |
| DataSheet: |  ESW-112-37-S-S Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 1.90260 |
| Insulation Color: | Black |
| Contact Finish Thickness - Post: | -- |
| Contact Material: | Phosphor Bronze |
| Contact Shape: | Square |
| Insulation Material: | Liquid Crystal Polymer (LCP) |
| Applications: | -- |
| Voltage Rating: | 550VAC |
| Current Rating: | 5.2A per Contact |
| Features: | -- |
| Ingress Protection: | -- |
| Mated Stacking Heights: | -- |
| Contact Finish - Post: | Tin |
| Material Flammability Rating: | UL94 V-0 |
| Operating Temperature: | -55°C ~ 125°C |
| Contact Length - Post: | 0.090" (2.29mm) |
| Insulation Height: | 0.435" (11.05mm) |
| Series: | ESW |
| Contact Finish Thickness - Mating: | 30.0µin (0.76µm) |
| Contact Finish - Mating: | Gold |
| Fastening Type: | Push-Pull |
| Termination: | Solder |
| Mounting Type: | Through Hole |
| Row Spacing - Mating: | -- |
| Number of Rows: | 1 |
| Pitch - Mating: | 0.100" (2.54mm) |
| Number of Positions Loaded: | All |
| Number of Positions: | 12 |
| Style: | Board to Board |
| Contact Type: | Forked |
| Connector Type: | Elevated Socket |
| Part Status: | Active |
| Packaging: | Bulk |
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ESW-112-37-S-S Application Field and Working Principle
The ESW-112-37-S-S product is categorized as a series of rectangular connectors - headers, receptacles, female sockets. It features a 50 mil pitch and includes a back mount, side mount, and keyed variety that allows right angle or vertical through hole connection. This product is designed for applications requiring high density and stability. It is manufactured with gold plating and is provided to withstand high temperature.
Application Field
The ESW-112-37-S-S product is suitable for use in high speed and low power data applications and serves as a bridge between the electronic components and circuit boards. It is commonly used in industrial equipment, cellular phones, televisions, personal computers, fiber optic equipment, medical devices, video games, and automotive sectors. It is also widely used for signal and power communications that need quick and reliable connections in order to achieve a stable system performance.
Working Principle
The working principle of the ESW-112-37-S-S product is based on interconnection properties. For reliable and stable connections, a good solder joint must be established between the two mating parts. It is recommended that the solder should be applied to the contact evenly and completely. It is important to keep in mind that connection reliability is heavily dependent on the quality of solder used and the proper application of it.
When installing this product, the user should pay attention to guidelines and instructions provided in the product manual. Directions for cleaning and preparation of the contacts and maintaining them are also provided in order to avoid the risk of overheating or damage. In addition, pre-assembly accessories, such as contact inserts and terminal blocks, can be used to guarantee the secure connection of two devices.
The ESW-112-37-S-S product is the best choice in high demand data transmission systems for quick and secure connections. In addition, its compact size makes it ideal for a variety of applications requiring densely populated circuit boards. This product comes with a warranty and all necessary accessories to ensure it is fit for customer requirements.
The specific data is subject to PDF, and the above content is for reference
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