ET60S-06-00-02-S-RT1-GP

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ET60S-06-00-02-S-RT1-GP is a specialized backplane connector featuring a metal casing, a backplane board, and multiple contacts. It is designed for use in a variety of applications including industrial computer systems, telecommunications systems, control systems, aerospace systems, and other high-performance environments. The connector supports both power and signal transmission, and offers excellent mechanical strength, signal integrity, and high contact density.

The connector consists of two main components: a backplane board and a metal housing. The board is designed with multiple layers of copper conductors and interconnecting vias. The board features a variety of contact types including compliant pins, non-compliant pins, and contactless pins, as well as other features like integrated ferrite beads. The metal housing provides complete shielding from EMI and helps maintain the signal integrity of the board. The metal housing also provides adequate mounting and securing points for the connector, reducing the risk of damage or accidental disconnection.

The connector supports multiple signal types and transmission protocols. It is rated to provide data rates up to 5Gbps, with total power up to 10W. Power transfer is handled through the use of mini-fit connectors, and signal types are supported up to 6GHz. The connector’s high contact density and robust mechanical performance are well-suited for high-density point-to-point connections and for reliable, high-bandwidth board-to-board connections.

The connector is rated for operation in a wide temperature range of -40ºC to +85ºC. It is also designed for robust performance in extreme vibration and shock environments. The metal housing is especially designed for effective protection from contaminates, which makes it suitable for harsh conditions in industrial, military, and aerospace applications.

The connector is designed to be used in a variety of applications and provides excellent signal integrity and mechanical strength for reliable data transmission and secure mounting. The high contact density and wide transmission rates make it well-suited for high-performance environments like industrial automation, aerospace, and telecommunications systems.

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