FMP300FRF73-3R3

FMP300FRF73-3R3 is one of the most popular through hole resistors used in a variety of applications. It is a resistor package that consists of three different resin layers bonded together with a copper wire. The resistor package is designed to provide superior protection against thermal and mechanical shock. The resistor package also offers excellent electrical impedance characteristics which make it suitable for various applications, such as signal processing, precision control, and data transmission.

The FMP300FRF73-3R3 is a three layer, through hole resistor package. The resistor package is composed of two plastics layers, the outer insulation layer and an inner substrate. The resistor\'s core, which carries the electrical current, is placed between the two layers. The resistor\'s core is made of metal and ceramic layers to provide superior heat and electrical resistance.

The FMP300FRF73-3R3 has an electrical resistance rating of 3.3 ohms. This resistance rating makes the device suitable for a range of applications, including power control, voltage conversion, and circuit protection. The resistor\'s small size makes it well-suited for use in tight spaces, while its robust construction allows it to withstand extreme temperatures and mechanical shocks.

The resistor is designed to operate under the following conditions: operating temperature range from -55°C to +90°C, operating frequency range from DC up to 1MHz, and rated storage temperature to -40°C.

The core components of the resistor are constructed using cutting-edge technologies, such as laser cutting and wire bonding. However, the resistor is not limited to one particular technology. The resistor package can be adapted to a variety of electronic components, such as switches, fuses, and connectors.

The FMP300FRF73-3R3 is available in two different styles: Through Hole Resistance and Surface Mount Technology. Through Hole Resistance utilizes an outer insulation layer which is then bonded to a substrate which contains components. The surface mount technology uses a substrate that does not require an insulation layer and usually has smaller physical dimensions than its through hole counterpart. This technology is advantageous because it reduces the number of components required and allows for the device to be mounted on smaller printed circuit boards (PCBs).

The FMP300FRF73-3R3 is an ideal through hole resistor for a variety of applications. It is designed to provide excellent electrical and thermal protection and long-term reliability, and to withstand extreme temperatures and mechanical shocks. It is also available in a number of different styles, allowing designers to select the optimal solution for their application. The resistor package is perfect for applications such as power control, signal processing, precision control, and data transmission.