FSI-105-10-L-D-TR

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The FSI-105-10-L-D-TR is an edge type, mezzanine connector array designed by Foxconn Interconnect Technology that is used for board to board connectivity. This connector is particularly well suited for applications that require a high flexibility in data transfer, as well as high power densities. This product is intended for use in high-end applications such as computer graphics, networking, and high-performance military and aerospace applications.

The connector consists of four primary elements: an edge type connector, a backplane connector, a heat sink, and a dielectric substrate. The edge type connector is a double-row array, which provides high-density connectivity for both vertical and horizontal data transfers. The backplane connector also has double rows, with inner and outer rows for data, power, and ground lines. The heat sink is used to dissipate the heat generated when the connector is in operation, and is designed to be easily removable for maintenance and upgrades. The dielectric substrate layer provides the additional insulation needed for this application.

When it comes to working principle, the FSI-105-10-L-D-TR is designed for board-to-board connectivity. Its edge type connectors provide a secure connection between the two boards, while the backplane connector helps ensure a robust connection. Power is supplied through the backplane connector, while data passes through the edge type connectors. The dielectric substrate acts as an additional layer of insulation between the two boards, preventing electrical shorts and ensuring a reliable connection.

The FSI-105-10-L-D-TR is an ideal solution for applications that require high flexibility in data transfer, as well as high power densities. Its edge type connectors provide a secure connection between the two boards, while the dielectric substrate provides additional insulation. Additionally, the heat sink can be easily removed for maintenance or upgrades. The FSI-105-10-L-D-TR is designed to meet the demands of today’s high-end applications, making it an ideal choice for computer graphics, networking, and high-performance military and aerospace applications.

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