FSI-130-03-G-S-M

The FSI-130-03-G-S-M is a high-speed, modular interconnect system used in edge card and board-to board applications. It is designed to provide a reliable, low impedance connection in a wide range of high-speed applications requiring high performance data paths and precision clock signals.

This FSI-130-03-G-S-M modular interconnect system is based on a symmetric array configuration incorporating three arrays. The array configuration allows for different pitches between the FSI connection points, making it possible to route data pathways quickly and efficiently. Additionally, the symmetrical array configuration also reduces termination and crosstalk issues, resulting in improved system performance.

The arrays are organized in a lattice-like fashion providing a compact form factor. The individual array fields are separated by optimum spacing so that the high-speed signals can run across the array without interference. The interconnect points are cemented into place to ensure secure current flow. The FSI-130-03-G-S-M edge card connection is accomplished using four-way Mil-spec pitch-and-socket connectors and is configured as four columns and three rows.

The FSI-130-03-G-S-M connector offers the user a variety of options for their application, including power, ground, and signal. The FSI130 also offers extra features such as the ability to daisy chain signals, reduce power consumption, and minimize crosstalk. Additionally, the FSI-130-03-G-S-M modular interconnect system provides advanced EMI shielding, fiber optic, and coaxial support.

The FSI-130-03-G-S-M is also designed to provide a robust connection that can support a wide range of high-performance data transmission protocols. The system is compliant with both ethernet and fiber optic data protocols, making it suitable for a wide range of network applications. Additionally, FSI-130-03-G-S-M has built in features that allow for a controlled impedance environment, ensuring that the signal integrity is preserved.

The FSI-130-03-G-S-M modular interconnect system can also be used to handle multiple frequency domain transmissions, making it ideal for both RF and non-RF applications. In addition, the FSI-130-03-G-S-M interface offers a variety of options for power, ground, and signal connections. Finally, the modular interconnect system has built-in EMI shielding and fiber optic capability, making it suitable for numerous applications.

In summary, the FSI-130-03-G-S-M is a high-speed, modular interconnect system used for edge card and board-to-board applications. It is designed to provide a reliable connection in a wide range of applications requiring high performance data pathways and clock signals. The FSI-130-03-G-S-M is a reliable interconnect system that provides advanced EMI shielding, fiber optic, and coaxial support. It is compliant with multiple frequency domain transmissions and offers multiple power, ground, and signal options for a variety of applications.