FTM-131-02-F-DV Allicdata Electronics
Allicdata Part #:

FTM-131-02-F-DV-ND

Manufacturer Part#:

FTM-131-02-F-DV

Price: $ 4.37
Product Category:

Connectors, Interconnects

Manufacturer: Samtec Inc.
Short Description: 1MM MICRO STRIPS
More Detail: Connector Header Surface Mount 62 position 0.039" ...
DataSheet: FTM-131-02-F-DV datasheetFTM-131-02-F-DV Datasheet/PDF
Quantity: 1000
1 +: $ 3.93120
Stock 1000Can Ship Immediately
$ 4.37
Specifications
Operating Temperature: -55°C ~ 125°C
Insulation Height: 0.038" (0.97mm)
Contact Shape: Square
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 3.00µin (0.076µm)
Contact Finish - Post: Tin
Contact Material: Phosphor Bronze
Insulation Material: Liquid Crystal Polymer (LCP)
Features: --
Overall Contact Length: --
Ingress Protection: --
Material Flammability Rating: --
Insulation Color: Black
Current Rating: 2.8A per Contact
Voltage Rating: --
Mated Stacking Heights: --
Contact Finish Thickness - Post: --
Applications: --
Number of Positions Loaded: All
Packaging: Tube 
Part Status: Active
Connector Type: Header, Cuttable
Contact Type: Male Pin
Pitch - Mating: 0.039" (1.00mm)
Number of Positions: 62
Number of Rows: 2
Row Spacing - Mating: 0.039" (1.00mm)
Series: FTM
Style: Board to Board
Shrouding: Unshrouded
Mounting Type: Surface Mount
Termination: Solder
Fastening Type: Push-Pull
Contact Length - Mating: 0.075" (1.90mm)
Contact Length - Post: --
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The FTM-131-02-F-DV is a connector type from the rectangular connectors - header, male pins and receptacles family. It boasts a number of features that make it a standout among its peers. It offers high-density board-to-board system interconnects with a high current capacity in a small space. In addition, it also provides an improved system reliability with an advanced ground system and an enhanced current carrying capability.

The FTM-131-02-F-DV has a 2.00 mm pitch and is a surface mount type which can easily and quickly be attached to a PCB. It also offers a low profile that is only 2.1 mm high, and allows for a low profile solution where space is limited. Its design also allows for a wide range of wire and jacket materials to be used for ruggedness and durability.

FTM-131-02-F-DV has a wide range of potential applications in equipment such as PCs, peripherals, networking and communication systems, industrial controls, audio/video consumer electronics, and computer-related products. Its design and features make it an ideal choice for applications requiring a low-profile, high-density system interconnect.

Working Principle

The FTM-131-02-F-DV uses a four-finger contact system to provide a secure and reliable connection. It also uses a unique dual beam structure which increases the overall contact force between the connector\'s pins and the board, ensuring a reliable connection in a vibration-prone environment. This type of connector also incorporates two pieces of stamped terminals which have a stepped shape design to ensure a secure connection when mating. This design also enables the connector to reach a maximum current carrying capacity of 3.0A, allowing it to be used in applications with higher current requirements.

In terms of installation, the connectors come with a mounting bracket and an EMI/RFI shield which is easily installed onto the PCB by soldering. This helps reduce EMI and RFI emissions, ensuring that the system will perform reliably for long periods of time.

When it comes to reliability, the FTM-131-02-F-DV features a unique low-contact-resistance soldering technology which is five times greater than that of standard soldering. This ensures a more reliable and secure connection while also reducing the contact resistance of the pins. The connector\'s advanced soldering technology also helps reduce the risk of electrical shorts and corrosion.

All in all, the FTM-131-02-F-DV is a reliable and versatile connector that is perfect for a variety of applications. Its combination of features such as a high current carrying capacity, low profile design, advanced soldering technology, and secure connection makes it a great choice for applications where space is limited and a reliable connection is crucial.

The specific data is subject to PDF, and the above content is for reference

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