HDC-H060-41S1-TG30 Allicdata Electronics
Allicdata Part #:

HDC-H060-41S1-TG30-ND

Manufacturer Part#:

HDC-H060-41S1-TG30

Price: $ 0.00
Product Category:

Connectors, Interconnects

Manufacturer: 3M
Short Description: CONN HEADER 60POS 4ROW VERT
More Detail: N/A
DataSheet: HDC-H060-41S1-TG30 datasheetHDC-H060-41S1-TG30 Datasheet/PDF
Quantity: 1000
Moisture Sensitivity Level (MSL): 1 (Unlimited)
Lead Free Status / RoHS Status: Lead free / RoHS Compliant
1 +: 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Number of Columns: --
Voltage Rating: --
Operating Temperature: -55°C ~ 105°C
Material Flammability Rating: UL94 V-0
Current Rating: 3A
Color: Black
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Finish: Gold
Features: --
Contact Layout, Typical: --
Termination: Solder
Mounting Type: Through Hole
Series: HDC (High Density Connector)
Number of Rows: 4
Pitch: 0.100" (2.54mm)
Number of Positions Loaded: All
Number of Positions: 60
Connector Style: High Density (HDC, HDI, HPC)
Connector Type: Header, Male Pins
Connector Usage: Backplane
Moisture Sensitivity Level (MSL): --
Part Status: Obsolete
Lead Free Status / RoHS Status: --
Packaging: Bulk 
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The HDC-H060-41S1-TG30 is a backplane connectors – specialized part specifically designed to fit the requirements of particular applications. As such, its application field and working principle are specialised to provide the necessary features given to a certain type of products.

In general, backplane connectors are specialised interconnects used between circuit boards to allow for the efficient and safe transmission of data. This type of connector requires specific specialised features such as spacing, board-to-board, right angle and total power connection to ensure system compatibility with different boards, modules and systems.

The HDC-H060-41S1-TG30 is a particularly high quality product that has been designed to deliver accurate and reliable performance. It has a total power connection, which is determined by its pin pitch and overall device dimensions. It also features a right-angle orientation to support higher data speeds, allowing for greater system performance and reliability.

The application field for the HDC-H060-41S1-TG30 is in systems where there are several boards that need to be connected. It provides a connecting interface which is reliable, durable, and versatile. It is particularly advantageous for systems such as computers, mobile phones, and other electronic devices which use a variety of different component boards.

The working principle of the HDC-H060-41S1-TG30 is based on its double layer interconnection. This system allows for reliable connection between board-to-board, while maintaining accurate alignment and connection for power and data. This permits efficient transmission of data, while also making sure that the system is properly accessible.

The HDC-H060-41S1-TG30 also features a specialised material construction for increased reliability and durability. It is made out of a combination of zinc, tin and copper, which is designed to facilitate faster and more reliable operation. This coating also offers improved protection against corrosion and wear, making it ideal for use in industrial and hazardous environments.

The HDC-H060-41S1-TG30 is a high quality backplane connectors - specialised part which is designed to provide reliable performance, accurate connections and durable construction. It is suitable for use in a wide range of applications, and its double layer interconnecting and specialised material construction ensure that it is an ideal choice for reliable systems.

The specific data is subject to PDF, and the above content is for reference

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