HDC-R200-41P1-KR Allicdata Electronics
Allicdata Part #:

HDC-R200-41P1-KR-ND

Manufacturer Part#:

HDC-R200-41P1-KR

Price: $ 46.63
Product Category:

Connectors, Interconnects

Manufacturer: 3M
Short Description: CONN HEADER 200POS R/A 4ROW GOLD
More Detail: N/A
DataSheet: HDC-R200-41P1-KR datasheetHDC-R200-41P1-KR Datasheet/PDF
Quantity: 1000
Lead Free Status / RoHS Status: Lead free / RoHS Compliant
Moisture Sensitivity Level (MSL): 1 (Unlimited)
504 +: $ 42.38330
Stock 1000Can Ship Immediately
$ 46.63
Specifications
Series: HDC (High Density Connector)
Packaging: Bulk 
Lead Free Status / RoHS Status: --
Part Status: Active
Moisture Sensitivity Level (MSL): --
Connector Usage: Backplane
Connector Type: Receptacle, Female Sockets
Connector Style: High Density (HDC, HDI, HPC)
Number of Positions: 200
Number of Positions Loaded: All
Pitch: 0.100" (2.54mm)
Number of Rows: 4
Number of Columns: --
Mounting Type: Through Hole
Termination: Press-Fit
Contact Layout, Typical: --
Features: --
Contact Finish: Gold
Contact Finish Thickness: 30.0µin (0.76µm)
Color: Black
Current Rating: 3A
Material Flammability Rating: UL94 V-0
Operating Temperature: -55°C ~ 105°C
Voltage Rating: --
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The HDC-R200-41P1-KR is a specialized backplane connector that unites superb mechanical stability with high-speed data transfer characteristics. Designed for telecommunication switch/router applications, this connector is especially suitable for use with optical modules, bridging the gap between the lighter bandwidth requirements of compact servers and the high-density architectures of modern data centers.

The HDC-R200-41P1-KR is an HDC (High Density Connector) type connector, easily recognizable by its unique orientation of 109-position contact array. This unique design offers many advantages when compared with conventional pin-and-socket structures. For one, the plastic latching system at the base of the contact array helps ensure an uninterruptable connection with the mother board. This, combined with the elimination of loose pins, allows for superior stability and data integrity. Furthermore, this latching system makes it possible to easily move and place the module in the required connection point.

These connectors are made using die-cast metals, high-performance thermoplastics, and exceptional surface treatments. This combination creates a robust connection that ensures high reliability and long-term performance. It also helps complete the module design for diverse environments, including automotive and industrial applications, telecom equipment, and powerline equipment. Furthermore, its EMI shielding and 20-GHz mating features help prevent unwanted radiation in extreme environments. This connector also features easy combination with latch locks for optimized couplings.

At its heart, the HDC-R200-41P1-KR backplane connector leverages the latest in bus technology to enable high-speed data transfer. By utilizing a bus-type transmission medium, this module eliminates noise generation and reduces power consumption. As a result, its advanced bus architecture makes it easier to connect multiple devices on the same bus without any signal interference. It also supports a wide range of data rates from 100 Mbps to 10 Gbps, enabling higher module integration and high data rates without the need for any external components.

In short, the HDC-R200-41P1-KR is the premier backplane connector for telecom switch and router applications. Its exceptional mechanical stability, high-speed transmission characteristics, robust design, and advanced bus architecture makes it the perfect choice for any telecommunication application. With its wide range of applications, it’s easy to see why the HDC-R200-41P1-KR is the backplane connector of choice for the advanced telecommunications user.

The specific data is subject to PDF, and the above content is for reference

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