HDC-S165-31S1-TG30 Allicdata Electronics
Allicdata Part #:

HDC-S165-31S1-TG30-ND

Manufacturer Part#:

HDC-S165-31S1-TG30

Price: $ 0.00
Product Category:

Connectors, Interconnects

Manufacturer: 3M
Short Description: CONN SOCKET 165POS R/A 3ROW GOLD
More Detail: N/A
DataSheet: HDC-S165-31S1-TG30 datasheetHDC-S165-31S1-TG30 Datasheet/PDF
Quantity: 1000
Moisture Sensitivity Level (MSL): 1 (Unlimited)
Lead Free Status / RoHS Status: Lead free / RoHS Compliant
1 +: 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Number of Columns: --
Voltage Rating: --
Operating Temperature: -55°C ~ 125°C
Material Flammability Rating: UL94 V-0
Current Rating: 3A
Color: Black
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Finish: Gold
Features: --
Contact Layout, Typical: --
Termination: Solder
Mounting Type: Through Hole, Right Angle
Series: HDC (High Density Connector)
Number of Rows: 3
Pitch: 0.100" (2.54mm)
Number of Positions Loaded: All
Number of Positions: 165
Connector Style: High Density (HDC, HDI, HPC)
Connector Type: Receptacle, Female Sockets
Connector Usage: --
Moisture Sensitivity Level (MSL): --
Part Status: Obsolete
Lead Free Status / RoHS Status: --
Packaging: Bulk 
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Backplane connectors are intricate and highly specialized connectors used in many different fields. The HDC-S165-31S1-TG30 backplane connector falls into this category and is used in a variety of applications. Through its unique design, the HDC-S165-31S1-TG30 offers enhanced performance in even the most demanding environments.

These highly specialized connectors are designed to meet stringent performance requirements. They are usually used in applications that have high clock speeds and very precise timing. Communications systems, computer hardware, and military systems often require this type of connector. They are also well suited for high vibration environments as well as those with extreme temperatures.

The HDC-S165-31S1-TG30 backplane connector offers multiple advantages over its competitor’s products. Its design provides superior signal integrity, increased power density, and improved noise compatibility. The connector is also built to eliminate crosstalk and provide superior noise rejection. These features make it an ideal choice for applications where high speed and precision are essential.

The HDC-S165-31S1-TG30 consists of two separate components which include the front panel and the backpanel. The front panel connects to the user’s hardware, while the back panel connects to the motherboard. The front panel is typically mounted to a flat surface like a circuit board, while the back panel attaches to the motherboard. The two panels are connected via a series of metal pins that make up the connector.

The HDC-S165-31S1-TG30 is designed with a modular locking system and an insulated shield. This shields the signal from noise and interference and helps ensure that the signal remains clean and reliable. In addition, the connectors have a unique high-density insulated sleeve which provides superior strength and contact integrity. For additional security, the high-density sleeve also prevents shocks and shorts from occurring.

The HDC-S165-31S1-TG30 provides superior signal performance and high levels of power density. It is designed for use in applications ranging from high-performance computer systems to industrial applications. This connector is also designed for ease of integration and simplified maintenance and support. The connector is certified for RoHS compliance, making it an ideal choice for applications where high performance and environmental standards are a priority.

In summary, the HDC-S165-31S1-TG30 backplane connector is a specialized connector designed to meet stringent performance requirements. Its design minimizes crosstalk and provides superior noise rejection. It is also certified for RoHS compliance and features a modular locking system and high-density insulation. This makes it an ideal choice for a wide range of applications including high performance computing, industrial applications, and military systems.

The specific data is subject to PDF, and the above content is for reference

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