HDC-S330-32S1-TG30 Allicdata Electronics
Allicdata Part #:

HDC-S330-32S1-TG30-ND

Manufacturer Part#:

HDC-S330-32S1-TG30

Price: $ 0.00
Product Category:

Connectors, Interconnects

Manufacturer: 3M
Short Description: CONN SOCKET 330POS R/A 3ROW GOLD
More Detail: N/A
DataSheet: HDC-S330-32S1-TG30 datasheetHDC-S330-32S1-TG30 Datasheet/PDF
Quantity: 1000
Moisture Sensitivity Level (MSL): 1 (Unlimited)
Lead Free Status / RoHS Status: Lead free / RoHS Compliant
1 +: 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Number of Columns: --
Voltage Rating: --
Operating Temperature: -55°C ~ 125°C
Material Flammability Rating: UL94 V-0
Current Rating: 3A
Color: Black
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Finish: Gold
Features: --
Contact Layout, Typical: --
Termination: Solder
Mounting Type: Through Hole, Right Angle
Series: HDC (High Density Connector)
Number of Rows: 3
Pitch: 0.100" (2.54mm)
Number of Positions Loaded: All
Number of Positions: 330
Connector Style: High Density (HDC, HDI, HPC)
Connector Type: Receptacle, Female Sockets
Connector Usage: --
Moisture Sensitivity Level (MSL): --
Part Status: Obsolete
Lead Free Status / RoHS Status: --
Packaging: Bulk 
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The HDC-S330-32S1-TG30 is a type of backplane connector, specifically designed for sensing and automation applications. As such, this type of backplane connector is often used when building more complex automation systems. By using backplane connectors to build custom systems, the designer can ensure that the system will run more efficiently and cost-effectively.

A backplane connector is a type of component used to link multiple printed circuit boards together. It allows different components of the same circuit board to be interoperable and also gives people the ability to easily and quickly create complex systems. The HDC-S330-32S1-TG30 is a type of special backplane connector, specifically designed for sensing and automation applications.

The HDC-S330-32S1-TG30 is capable of transferring up to 32 channels of data at a time. This type of backplane connector includes an electrical, thermal, and mechanical design, ensuring that it is capable of handling high-density electronic and electrical connections with ease. It can also detect and identify electrical and short-circuits, helping to prevent damage to the system.

This type of backplane connector also helps data communications between the various components of the system. It is designed to minimize noise and crosstalk, which allows for better control of the system and more accurate data reading. The HDC-S330-32S1-TG30 has been designed to be highly reliable, ensuring that the system is safe and functioning properly at all times.

The HDC-S330-32S1-TG30 is highly versatile and has a wide range of applications in sensing and automation. It is typically used in the manufacturing and automotive industries for controlling different types of processes. The connectors provide efficient and secure connections between sensors and process control devices, making them ideal for industrial use. The connectors are also widely used for monitoring systems, such as those used in data centers.

The working principle of the HDC-S330-32S1-TG30 is fairly straightforward. The connectors use a non-conductive material to create a secure connection between the various components of the system. This material acts as an electrical barrier, preventing the components from coming into direct contact with each other and avoiding potential electrical hazards. The connectors also have a variety of features, including power and data transfer protection, improved ground isolation, and enhanced signal integrity.

The HDC-S330-32S1-TG30 is a reliable and versatile backplane connector and is widely used for a range of sensing and automation applications. It is capable of providing up to 32 channels of data, as well as providing data and power protection. The connectors also offer improved ground isolation and enhanced signal integrity, making them ideal for use in complex automation systems.

The specific data is subject to PDF, and the above content is for reference

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