HIF3H-18DB-2.54DS(71)

Insulation Color:	Black
Contact Finish Thickness - Post:	39.4µin (1.00µm)
Contact Material:	Phosphor Bronze
Contact Shape:	Square
Insulation Material:	Polybutylene Terephthalate (PBT)
Applications:	General Purpose
Voltage Rating:	300VAC
Current Rating:	3A
Features:	--
Ingress Protection:	--
Mated Stacking Heights:	--
Contact Finish - Post:	Tin
Material Flammability Rating:	UL94 V-0
Operating Temperature:	-55°C ~ 85°C
Contact Length - Post:	0.126" (3.20mm)
Insulation Height:	0.236" (6.00mm)
Series:	HIF3H
Contact Finish Thickness - Mating:	8.00µin (0.203µm)
Contact Finish - Mating:	Gold
Fastening Type:	--
Termination:	Solder
Mounting Type:	Through Hole, Right Angle
Row Spacing - Mating:	0.100" (2.54mm)
Number of Rows:	2
Pitch - Mating:	0.100" (2.54mm)
Number of Positions Loaded:	All
Number of Positions:	18
Style:	Board to Board
Contact Type:	Female Socket
Connector Type:	Receptacle
Part Status:	Active
Packaging:	Tray

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Rectangular Connectors – Headers, Receptacles, Female Sockets

The HIF3H-18DB-2.54DS (71) is a versatile application within the rectangular connectors industry. It is one of the most reliable and widely used modules available and is most suitable in applications ranging from consumer electronics and computers to communication, automotive and industrial applications. This particular model is made of four wires and is designed to have a soldering tail length of 71mm.This module is primarily used as a header that has 2.54mm of spacing between each of the pins. It can also be used as a receptacle or a female socket to connect either male pins or other female modules. It is capable of reliably connecting to a wide variety of layouts and form factors, making it a popular choice in many applications. Additionally, the HIF3H-18DB-2.54DS (71) has a maximum current rating of 4.0A making it suitable for most consumer electronics.The main advantage of using the HIF3H-18DB-2.54DS (71) module is its built-in reliability. Its pins are made of high-quality brass and each wire is reliably and robustly molded to the housing. Furthermore, this device is designed with a high heat-resistant outer shell which makes it suitable for most soldering activities. The terminals are also gold-plated to ensure excellent electrical contact between the wires and the device, providing excellent data transmission capabilities. The device also has a low-profile design to allow for easy installation even in tight spaces. Additionally, it has a highly stable and secure locking mechanism to ensure that the module remains securely in place once connected. The modularity of the HIF3H-18DB-2.54DS (71) allows users to easily connect it to various other devices. This module is generally used withthrough-hole, surface-mount and screw-terminal applications. Additionally, some versions are available with an optional baseplate. This provides additional stability to the connection and allows for a secure installation without the need for further soldering. The working principle of the HIF3H-18DB-2.54DS (71) module is relatively simple. The module consists of four pins, two used for powering the device and two for connecting to other components. The power and ground pins are clearly labeled, making it easy to follow the wiring schematic. Then, once the device is correctly wired up, the user can simply insert the module into the header and lock it in place with the locking mechanism. The module is then ready for use. Overall, the HIF3H-18DB-2.54DS (71) module is an ideal choice in wide variety of applications. Its reliable design, gold-plated contacts and locking mechanism ensure excellent performance and durability. Additionally, its modularity and low-profile design make it easy to install, even in spaces with tight restrictions. For these reasons, the module is widely used in many consumer electronics, communication and automotive applications.

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