HM-H055B1-5CP1-TG30

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Backplane Connectors - Hard Metric, Standard provide a wide range of reliable and cost-effective solutions for the high-speed interconnection of data and power between PCBs and other components. The HM-H055B1-5CP1-TG30 is a Hard Metric connector from the Hirosaki Series, designed for applications requiring high-speed transmission and directional signal integrity.

The Hirosaki series is one of the most advanced line of backplane connectors, with its unique combination of durability, quality, performance, interoperability, and power performance. The HM-H055B1-5CP1-TG30 is designed to mate with any standard 5U height (125mm) backplane. With 5 differential pairs of signal contacts in a low profile body, this Hard Metric connector is designed to provide high density, reliable signal integrity, and low crosstalk.

The HM-H055B1-5CP1-TG30 features the patented port-lock connection system with locking ratchet for secure connection and improved plating reliability. The contact surfaces are designed to minimize insertion and removal force for integration ease. The connectors are zinc die-cast and double-plated for improved reliability and support both solid and stranded wires.

The HM-H055B1-5CP1-TG30 also features an advanced signal path optimized for high-speed signals with a transmission line that has an impedance of 45 ohms to ensure stable signal quality. Its design also enables the optimization of insertion loss and crosstalk. The high-accuracy mating system reduces misalignment between connectors. In addition, the connectors are designed with press-fit push-in contacts to minimize installation time.

The HM-H055B1-5CP1-TG30 is suitable for a wide range of high-speed serial data applications, including industrial automation, Infotainment, medical, and telecom. It is also suitable for Ethernet, PCIe, SATA, and USB3.0 data interfaces. The connector is able to handle data rates of up to 12 Gbps, making it ideal for high-speed applications.

The HM-H055B1-5CP1-TG30 is an ideal solution for applications requiring high-speed signal transmission and reliable electrical and thermal performance. The combination of its ease of use, robust design, low-profile housing, high-performance contact design, and low crosstalk make it suitable for a variety of high-speed data applications.

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