HM1L53BDP000H6P

Number of Columns:	--
Voltage Rating:	--
Operating Temperature:	-55°C ~ 125°C
Material Flammability Rating:	UL94 V-0
Current Rating:	1A
Color:	Natural
Contact Finish Thickness:	30.0µin (0.76µm)
Contact Finish:	Gold
Features:	Board Guide
Contact Layout, Typical:	--
Termination:	Press-Fit
Mounting Type:	Board Edge, Through Hole, Right Angle
Series:	Metral®
Number of Rows:	5
Pitch:	0.079" (2.00mm)
Number of Positions Loaded:	All
Number of Positions:	120
Connector Style:	--
Connector Type:	Header, Male Pins
Connector Usage:	--
Moisture Sensitivity Level (MSL):	--
Part Status:	Obsolete
Lead Free Status / RoHS Status:	--
Packaging:	Tray

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Backplane Connectors - Specialized: HM1L53BDP000H6PThe HM1L53BDP000H6P is a high-performance module backplane connector designed for highly specialized applications. It is designed to meet the highest industry standards and offers a unique combination of features that make it ideal for connecting backplanes and components in data centers and other specialized environments.The HM1L53BDP000H6P features an innovative low-profile design that allows for improved physical accessibility, making it suitable for use in cramped and/or restricted spaces. This design also helps minimize interference from adjacent connectors due to its compact size. The HM1L53BDP000H6P is rated for data transmission speeds up to 25 Gb/s, making it a great choice for applications that require the maximum data rate.The connector is based on a four-terminal contact system with uniform terminal spacing and improved electrical connection reliability compared to a conventional three-terminal contact system. The pin pitch is 0.8 mm, which is the most commonly used pitch in the industry. This ensures compatibility with other available devices and provides a wide range of connectivity options. Furthermore, the insulation displacement contacts (IDCs) are built in to the design for a reliable and easy connection that requires no soldering.The HM1L53BDP000H6P also has an enhanced shielding design which provides improved signal integrity and data transmission speeds. The shielding covers both the connector and the backplane itself, providing extended protection against EMI and EMC. Furthermore, the shielding offers robustness and durability when operating in harsh environments, making it ideal for use in data centers and other demanding applications.In addition, the contacts of the HM1L53BDP000H6P feature gold-plated contacts which provide excellent corrosion resistance and durability in high-temperature environments. This ensures that the reliability of the connection will not be compromised over time. The wiring contacts also feature a B-TFMA housing for improved tactile feel and signal integrity. The contacts are constructed using a high-quality material to ensure a reliable connection, while the contact force is adjustable for optimal connectivity.Overall, the HM1L53BDP000H6P is an excellent choice for high-performance applications where reliability, high-speed, and extended durability are critical. With an innovative design and superior features, it is ideal for any application where space is a major factor, and its compatibility with other devices and components makes it ideal for use in multiple deployments and environments.

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