HM2P07PKE380GF

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Backplane Connectors - Hard Metric, Standard, and HM2P07PKE380GF have been developed as high-speed, high-performance and reliable interconnect solutions, specifically for applications in telecommunications, military and aerospace, industrial and medical markets. The HM2P07PKE380GF is a single-pair, one-piece, ultra-low-profile system-on-system connector designed for embedded applications with tight interconnects. Its high-performance, low profile design allows for easy and flexible installation, making the connector suitable for a wide range of applications from system-on-chip (SoC) embedded backplanes and fanout boards to mid-plane applications.

The HM2P07PKE380GF has a unique patented "snap-in" mechanism that allows it to be easily and securely installed. With its two-piece design, the connector features convenient single-piece latching and removal. The two-piece design significantly reduces the assembly cost and space required when compared to other interconnect solutions. The connector also has a wide variety of interconnection options, ranging from a single-pair to a multi-pair system. Furthermore, the HM2P07PKE380GF is designed with a transfer compliant central panel that eliminates pre-stressing when assembled and can support up to 16 interconnects per pair.

The HM2P07PKE380GF offers a robust design with reliable signal integrity. The design includes a wide contact area that improves the insertion and extraction force, preventing contact damage and wear. Additionally, the connector features a patented millimeter-wave-shielding layer, helping to reduce crosstalk and improve signal integrity. The connector also has a wide range of pitch sizes available, ranging from 0.7 mm (hard metric), 0.6 mm (hard metric plus) and 0.5 mm (standard).

The HM2P07PKE380GF can operate in temperatures up to 120°C and is compliant with many international standards, including UL, CSA, VDE, IEC, and SAE. The board-to-board system offers up to a 2.5GHz frequency range and provides excellent impedance control and signal integrity. It is ideal for use in harsh environments, where EMI and RFI protection are a must.

In addition, the HM2P07PKE380GF is compliant with RoHS standards and supports a range of customizations, making it a versatile connector for systems that require higher performance and robust signal integrity. It is designed to be used in embedded applications such as Automotive, CPU board to board, power converters, telecom modules, memory modules, and more.

In summary, the HM2P07PKE380GF is a high-performance, robust, and reliable board-to-board interconnect solution designed for embedded applications in harsh environments. It features a patented "snap-in" mechanism, wide contact area, and a transfer compliant central panel that reduces pre-stressing when assembled. It is compliant with various international standards, including UL, CSA, VDE, IEC, and SAE. Additionally, it supports up to 2.5GHz frequency range, EMI and RFI protection, and customizations, making it an ideal solution for a wide range of embedded applications.

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