HM2P07PKE3C0GF Allicdata Electronics
Allicdata Part #:

HM2P07PKE3C0GF-ND

Manufacturer Part#:

HM2P07PKE3C0GF

Price: $ 0.00
Product Category:

Connectors, Interconnects

Manufacturer: Amphenol FCI
Short Description: MPAC 5R ST PF HDR
More Detail: 154 (110 + 44 Ground) Position Header, Male Pins C...
DataSheet: HM2P07PKE3C0GF datasheetHM2P07PKE3C0GF Datasheet/PDF
Quantity: 1000
Lead Free Status / RoHS Status: Lead free / RoHS Compliant
Moisture Sensitivity Level (MSL): 1 (Unlimited)
1 +: 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Series: Millipacs®
Packaging: Tray 
Lead Free Status / RoHS Status: --
Part Status: Obsolete
Moisture Sensitivity Level (MSL): --
Connector Type: Header, Male Pins
Connector Style: A 22
Number of Positions: 154 (110 + 44 Ground)
Number of Positions Loaded: All
Pitch: 0.079" (2.00mm)
Number of Rows: 5 + 2
Mounting Type: Through Hole
Termination: Press-Fit
Connector Usage: --
Contact Finish: Gold
Contact Finish Thickness: 30.0µin (0.76µm)
Current Rating: 1.5A
Voltage Rating: 750Vrms
Operating Temperature: -55°C ~ 125°C
Features: Board Guide
Description

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Backplane Connectors are a vital component in the field of data communication, computer boards and other electronic equipments. Hard Metric and Standard are two main types of backplane connectors. HM2P07PKE3C0GF is one of the many product series of backplane connectors. It is designed to provide reliable data communication, signal transmission and power connection in very short time. It is widely used in the area of computer boards and other electronic equipments, such as switches and routers on the Horizon. It offers low profile, speed, and reliability as well as excellent performance.

The HM2P07PKE3C0GF is a Hard Metric Backplane Connector. It is a type of backplane connector designed to interface with small form factor storage devices, allowing data to flow between them with very low levels of electrical and magnetic interference. Its network architecture is based upon the PCIe standard, providing a uniform expansion interface for various types of peripherals, such as PCI Express cards, solid-state drives and other devices. As a result, the connector provides high speed and reliability to even the most demanding applications. The system is widely favored for its low profile, high bandwidth, and excellent mechanical performance.

The HM2P07PKE3C0GF is capable of data transfer rates of up to 12 Gb/s. It is designed to provide a low-profile solution which establishes a high-speed connection between multiple boards and its peripheral components. With its optimal size, this connector can be used in variety of form factors such as TSSOP, LTW, and LRW enabling the connection of up to 8 lanes. Aside from that, it also includes spring contacts to ensure a reliable connection during the disconnection / wiring operation. Additionally, the connect’s press-fit features ensure a hassle free installation process in such tight spaces.

The HM2P07PKE3C0GF is robust and resilient in nature. It is rated to a Current rating of 3A, Voltage rating of 30V, Contact Resistance of 10 mOhm Max, and Dielectric withstanding Voltage of 300 VAC. As a result, it offers reliable connection and data transmission against external interference. Additionally, it is RoHS compliant and IP67 rated. This means that the connector can sustain various tough US/EU environmental conditions such as extreme temperature, shock, vibration, humidity, and other hazardous elements.

In conclusion, the HM2P07PKE3C0GF is an ideal Hard Metric Backplane Connector for data communication, signal transmission and power connection. It offers reliable performance, low profile design, high bandwidth, and compatibility for small form factor storage devices. This connector is highly reliable and designed to withstand tough environmental conditions. It is also RoHS compliant and IP67 Rated. With its superior quality and reliability, it is frequently used in the areas of computer boards and other electronic equipments. It is an excellent choice for businesses wanting the best performance and reliability in their data communication and signal transmission networks.

The specific data is subject to PDF, and the above content is for reference

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