HM2P07PNM120GFLF

Backplane connectors are a type of electrical connector used to connect electronic components and assemblies in circuit board systems. The HM2P07PNM120GFLF is one such backplane connector, belonging to the hard metric standard.

Features and Specifications

HM2P07PNM120GFLF is an 18-way backplane connector with a mounting type of mounting clip. Its pitch is 2mm, with a high pin count of 120 pins. The connector is compliant with the FCI (Molex) specification. The housing is made of a thermoplastic UL94V-0 material and the contacts are stamped and gold plated. The insulation resistance is greater than 10 KOhms and the electrical current rating is 1.5Aac/3.0Adc.

Applications

The HM2P07PNM120GFLF is ideal for use as a backplane interconnect in circuit board systems that require high pin count and frequent re-configurations. It is also well-suited for any applications involving high-speed data transmission. The connector is widely used in a variety of industrial automation, instrumentation, communication systems, banking, medical imaging, and consumer electronics.

Working Principle

The basic principle of the HM2P07PNM120GFLF is to provide a reliable connection between multiple electronic components in circuit board systems. The contacts of the connector are made of thermoplastic material, which provides a secure and dependable connection between the two mating parts. The connector is designed with two rows of contact pins, one for power supply and another for signal transmission. The pins are gold plated to ensure high signal integrity and to minimize cross-talk. The connector further exhibits EMI/RFI shielding properties, an improved crosstalk performance, and an enhanced immunity to ESD and EMI.

Conclusion

HM2P07PNM120GFLF is a backplane connector that belongs to the hard metric standard. It is a high-pin count connector with a pitch of 2mm, thermoplastic UL94V-0 housing, and stamped and gold plated contacts. The connector is suitable for a variety of circuit board applications that involve high-speed data transmission and re-configuring. It offers excellent EMI/RFI shielding properties, improved crosstalk performance, and enhanced immunity to ESD and EMI.