Allicdata Part #: | HM2P08PCH171N9-ND |
Manufacturer Part#: |
HM2P08PCH171N9 |
Price: | $ 0.00 |
Product Category: | Connectors, Interconnects |
Manufacturer: | Amphenol FCI |
Short Description: | MPAC 5R ST PF HDR |
More Detail: | 175 (125 + 50 Ground) Position Header, Male Pins C... |
DataSheet: | HM2P08PCH171N9 Datasheet/PDF |
Quantity: | 1000 |
Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
1 +: | 0.00000 |
Series: | Millipacs® |
Packaging: | Tray |
Lead Free Status / RoHS Status: | -- |
Part Status: | Obsolete |
Moisture Sensitivity Level (MSL): | -- |
Connector Type: | Header, Male Pins |
Connector Style: | B 25 |
Number of Positions: | 175 (125 + 50 Ground) |
Number of Positions Loaded: | All |
Pitch: | 0.079" (2.00mm) |
Number of Rows: | 5 + 2 |
Mounting Type: | Through Hole |
Termination: | Press-Fit |
Connector Usage: | -- |
Contact Finish: | Gold |
Contact Finish Thickness: | 30.0µin (0.76µm) |
Current Rating: | 1.5A |
Voltage Rating: | 750Vrms |
Operating Temperature: | -55°C ~ 125°C |
Features: | -- |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Backplane connectors are becoming increasingly important as the speed and data requirements of system buses continue to evolve. The HM2P08PCH171N9 is one of the latest and most advanced backplane connectors on the market today. This hard metric, standard connector is designed for use in multi-gigabit Ethernet and high-speed digital applications, as well as other high-performance applications.
The design of the HM2P08PCH171N9 is optimized for high-density signal mitigation. It uses a square contact design that reduces crosstalk and provides better performance than a traditional round contact design. The connector also features a low-insertion force and is designed to reduce electrical noise and provide robust mechanical strength. Additionally, the connector has a high temperature range, making it suited for use in high-temperature applications.
The HM2P08PCH171N9 has a black zinc-alloy shell with a stainless steel latch and dielectric, providing superior shielding performance. The latch gives the connector secure locking action and superior strength, while the dielectric material provides excellent flexibility and dielectric constants. The connector also has a front-mount thumb latch that makes it easy to connect and disconnect.
The HM2P08PCH171N9 features an Interconnect Module (IM) design that allows for greater flexibility in designing, and implementation of, complex multi-gigabit applications. The IM allows for more flexible design and routing of signal paths, as well as control of the drive line signal trace impedance. This allows for improved signal integrity and power efficiency. The IM also has a wide range of high-speed contact materials and low-resistance contact crimps, enabling superior electrical performance.
The HM2P08PCH171N9 can also be used in a wide range of applications. The connector is an ideal choice for digital signal processing (DSP) applications, as it offers superior signal integrity over traditional backplane connectors. Additionally, the HM2P08PCH171N9 can be used in high-speed transfer applications, such as memory and networking. The connector is also suitable for use in high-bandwidth applications such as video and audio transmission.
In summary, the HM2P08PCH171N9 is a hard metric, standard backplane connector that is designed for use in multi-gigabit Ethernet and other high-performance applications. It is designed with a square contact design that reduces crosstalk and provides better performance than traditional round contact designs. The connector features an Interconnect Module design that offers superior signal integrity and power efficiency, as well as a wide range of contact materials and low-resistance contact crimps for improved electrical performance. Additionally, the connector is suitable for use in a wide range of applications, such as DSP, high-speed transfer, memory, networking, and video/audio transmission.
The specific data is subject to PDF, and the above content is for reference
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