Allicdata Part #: | HM2P08PDN1W1N9-ND |
Manufacturer Part#: |
HM2P08PDN1W1N9 |
Price: | $ 0.00 |
Product Category: | Connectors, Interconnects |
Manufacturer: | Amphenol FCI |
Short Description: | MPAC 5R ST PF HDR |
More Detail: | 175 (125 + 50 Ground) Position Header, Male Pins C... |
DataSheet: | HM2P08PDN1W1N9 Datasheet/PDF |
Quantity: | 1000 |
Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
1 +: | 0.00000 |
Series: | Millipacs® |
Packaging: | Tray |
Lead Free Status / RoHS Status: | -- |
Part Status: | Obsolete |
Moisture Sensitivity Level (MSL): | -- |
Connector Type: | Header, Male Pins |
Connector Style: | B 25 |
Number of Positions: | 175 (125 + 50 Ground) |
Number of Positions Loaded: | All |
Pitch: | 0.079" (2.00mm) |
Number of Rows: | 5 + 2 |
Mounting Type: | Through Hole |
Termination: | Press-Fit |
Connector Usage: | -- |
Contact Finish: | Gold |
Contact Finish Thickness: | 30.0µin (0.76µm) |
Current Rating: | 1.5A |
Voltage Rating: | 750Vrms |
Operating Temperature: | -55°C ~ 125°C |
Features: | -- |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Backplane Connectors - Hard Metric, Standard have come a long way in just a few decades. The HM2P08PDN1W1N9 series provides a robust, reliable interconnect solution for high-speed data applications. It is designed to ensure reliable performance in a range of applications and operating environments where vibration and shock may be a concern.
The HM2P08PDN1W1N9 is a 2-row, 8-contact backplane connector featuring an advanced power contact design that includes an extra tongue and groove feature. This design provides improved electrical contact for better signal integrity while maintaining a low-profile and secure connection. The power contacts are compliant with the current version of IEC 60309-3 standard and meet the requirements for high reliability and ruggedness with a rated current of 15A and an operating temperature range of -55°C to 125°C. It is also UL recognized and CE compliant.
In addition to the robust, reliable power contact, the HM2P08PDN1W1N9 features a board-to-board stacking height of 18.5mm and the ability to stack up to three boards securely. The connector uses a solder cup interface for a top-level connection to the board. It also features high-retention, square flange D-sub latching hardware which provides increased securement and retention.
The HM2P08PDN1W1N9 is ideal for use in applications such as datacom, telecom, industrial automation, medical applications, data acquisition, switch mode power supplies, and consumer electronics. It is well suited for high-density architectures, given its low-profile design and double-row, 8-contact configuration. This connector series provides an economical solution that also meets MIL-STD-1275D requirements.
The operating principle of the HM2P08PDN1W1N9 is straightforward. The two rows of contacts fit into separate mating holes on the backplane, which act as the electrical connection point for the board-to-board connection. The latching hardware is then secured to the board to ensure a secure connection. When the connector is mated, the power contacts are connected electrically and high-speed data signals are transmitted from one board to the other. The D-sub latching hardware provides a secure connection to ensure reliable performance, even in extreme operating conditions.
The HM2P08PDN1W1N9 is a robust, reliable interconnect solution for a wide range of applications. It offers several features such as a solder cup interface, high-retention D-sub latching hardware, board-to-board stacking, and compliance with IEC 60309-3 standards. Its low-profile design and double-row, 8-contact configuration make it an ideal choice for space-constrained applications. Furthermore, it meets MIL-STD-1275D requirements and is added safety to your system providing reliable performance in adverse operating conditions.
The specific data is subject to PDF, and the above content is for reference
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