HM2P09PDG2G0N9 Allicdata Electronics
Allicdata Part #:

HM2P09PDG2G0N9-ND

Manufacturer Part#:

HM2P09PDG2G0N9

Price: $ 0.00
Product Category:

Connectors, Interconnects

Manufacturer: Amphenol FCI
Short Description: CONN HEADER 55POS TYPE C VERT
More Detail: 55 Position Header, Male Pins Connector 0.079" (2....
DataSheet: HM2P09PDG2G0N9 datasheetHM2P09PDG2G0N9 Datasheet/PDF
Quantity: 1000
Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
Moisture Sensitivity Level (MSL): 1 (Unlimited)
1 +: 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Series: Millipacs®
Packaging: Tray 
Lead Free Status / RoHS Status: --
Part Status: Obsolete
Moisture Sensitivity Level (MSL): --
Connector Type: Header, Male Pins
Connector Style: C 11
Number of Positions: 55
Number of Positions Loaded: 30
Pitch: 0.079" (2.00mm)
Number of Rows: 5
Mounting Type: Through Hole
Termination: Press-Fit
Connector Usage: --
Contact Finish: Gold
Contact Finish Thickness: Flash
Current Rating: 1.5A
Voltage Rating: 750Vrms
Operating Temperature: -55°C ~ 125°C
Features: Board Guide
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Backplane connectors are commonly used in various industrial applications and have become a vital component of modern industrial technology. The HM2P09PDG2G0N9 is the latest version and is well-suited to a range of applications.

Application Field of HM2P09PDG2G0N9

The HM2P09PDG2G0N9 backplane connector is a multi-function feature-rich product designed for high-speed Ethernet/IP applications. It offers superior performance, reliability, and a robust design that can withstand a wide range of potential conditions. It has the capability to handle up to 2.54 Gb/s transmission speeds as well as temperature stability from -55°C to +125°C. In addition, the connector comes with a robust PCB and is also compatible with various industry protocols.

The HM2P09PDG2G0N9 is an ideal choice for applications requiring high data transmission rates while maintaining stringent reliability and application flexibility. Applications using HM2P09PDG2G0N9 connectors include telecoms, defence, aerospace, automotive, and industry control systems.

Working Principle of HM2P09PDG2G0N9

The HM2P09PDG2G0N9 backplane connector is a high-performance, high-density product designed to simplify system integration and reduce the complexity and size of the assembly. It offers quick installation, superior signal integrity, and better performance over a wide temperature range. It is designed to meet EMI shielding requirements for high-speed digital applications.

The connector features an advanced contact design that helps to improve signal transmission accuracy and reduce signal loss. This design gives the connector enhanced mechanical and temperature stability, which ensures an even higher level of reliability and compatibility. The connector’s increased transmission speed also provides better response times, which can translate into increased production efficiency and cost savings.

Apple\'s modular design allows you to create custom configurations that meet your exact requirements. The modular design also increases board layout flexibility while eliminating potential design errors. It also provides increased flexibility for electronic assembly and decrease time-to-market.

In summary, the HM2P09PDG2G0N9 backplane connector is an effective solution for a wide range of high-speed applications. It offers superior performance, reliability, and robustness. It also provides quick installation, superior signal integrity, and better performance over a wide temperature range. The connector\'s modular design allows for custom configurations and increased flexibility for electronic assembly.

The specific data is subject to PDF, and the above content is for reference

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