HM2P09PDK330N9LF Allicdata Electronics
Allicdata Part #:

HM2P09PDK330N9LF-ND

Manufacturer Part#:

HM2P09PDK330N9LF

Price: $ 0.72
Product Category:

Connectors, Interconnects

Manufacturer: Amphenol FCI
Short Description: MPAC 5R ST PF HDR
More Detail: 55 Position Header, Male Pins Connector 0.079" (2....
DataSheet: HM2P09PDK330N9LF datasheetHM2P09PDK330N9LF Datasheet/PDF
Quantity: 1000
Lead Free Status / RoHS Status: Lead free / RoHS Compliant
Moisture Sensitivity Level (MSL): 1 (Unlimited)
576 +: $ 0.65412
Stock 1000Can Ship Immediately
$ 0.72
Specifications
Series: Millipacs®
Packaging: Tray 
Lead Free Status / RoHS Status: --
Part Status: Active
Moisture Sensitivity Level (MSL): --
Connector Type: Header, Male Pins
Connector Style: C 11
Number of Positions: 55
Number of Positions Loaded: All
Pitch: 0.079" (2.00mm)
Number of Rows: 5
Mounting Type: Through Hole
Termination: Press-Fit
Connector Usage: --
Contact Finish: Gold
Contact Finish Thickness: 30.0µin (0.76µm)
Current Rating: 1.5A
Voltage Rating: 750Vrms
Operating Temperature: -55°C ~ 125°C
Features: Board Guide
Description

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Backplane Connectors - Hard Metric, Standard - and, more specifically, HM2P09PDK330N9LF - are an important piece of hardware pushed to its limits in many industrial applications. This connector is a prime example of how different industries are making use of connector technology to optimize system performance, increase reliability, and reduce costs. To better understand how this integrated circuit connects to various types of backplane configurations, it is handy to discuss its application fields and working principle.

The HM2P09PDK330N9LF is a high-speed differential hard metric connector developed for use in applications where high transmittance data is needed. This connector was designed mainly for use in data centers, where there is an increasing demand for higher data speeds. Since it has a wide range of transmission capabilities and is compliant with many standards, it is popular among system installers dealing with large-scale high-speed networks. Moreover, this type of connector is often employed in optical insulation systems such as telecommunication and Ethernet networking.

The working principle of HM2P09PDK330N9LF is fairly simple. It consists of a central card, called the “backplane connector”, onto which a set of pins are attached. The pins are used to make contact with various external components, such as cables, hard drives, optical drives, chip sockets etc. The pins provide connection points for the various external components to send/receive data in a rigorous and controlled manner. The contacts are placed in a contact pattern, which is then further connected to other component connections of the same pattern to establish a connection and enable a data transmission.

The HM2P09PDK330N9LF is mainly used in the areas of embedded systems, telecommunications networks, cloud computing and storage, ATM and POS peripherals, industrial system control and monitoring, visualization systems, digital signage, test and measurement solutions, datacenters, and automotive and industrial control applications. It is rated for transmission speeds up to 350 MBps with a timing skew of 1-2 ns. Furthermore, it facilitates a temperature range of -40°C to +120°C, thus making it suitable for a wide range of operation conditions.

When looking at the advantages of using the HM2P09PDK330N9LF, one can see that it is an industrial-grade connector that provides an excellent level of data protection and performance. Thanks to its high number of contacts and superior quality of components, it is noted for its reliability and consistent data performance. Additionally, this hard metric connector is designed to be interlocked in place, making it a good choice for both horizontal and vertical synchronization. Additionally, its differential pairs and symmetric structure ensure a low crosstalk level and minimal signal degradation hence increases signal integrity.

In summary, this connector is ideal for a wide range of industrial applications. With its high transmission speed capabilities, robust design, and interlocking structure, it is capable of handling large-scale high-speed networks with ease and efficiency. Moreover, it is backed by qualified components and offers reliable performance and consistent, low-noise data protection. It is well suited for a variety of embedded system, telecommunications, industrial system, and automotive and industrial control applications.

The specific data is subject to PDF, and the above content is for reference

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