HM2P11PDG3M0N9

Series:	Millipacs®
Packaging:	Tray
Lead Free Status / RoHS Status:	--
Part Status:	Obsolete
Moisture Sensitivity Level (MSL):	--
Connector Type:	Header, Male Pins
Connector Style:	M 11
Number of Positions:	58 (55 + 3 Power)
Number of Positions Loaded:	55
Pitch:	0.079" (2.00mm)
Number of Rows:	5
Mounting Type:	Through Hole
Termination:	Press-Fit
Connector Usage:	--
Contact Finish:	Gold
Contact Finish Thickness:	30.0µin (0.76µm)
Current Rating:	1.5A
Voltage Rating:	750Vrms
Operating Temperature:	-55°C ~ 125°C
Features:	Board Guide

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Introduction

HM2P11PDG3M0N9 is a type of backplane connector, which belongs to the category of hard metric, standard. HM2P11PDG3M0N9 offers high circuit capability in a small form factor to provide designers with the flexibility to incorporate it into any design. HM2P11PDG3M0N9 is becoming increasingly popular in the current market due to its high power handling capability, excellent signal integrity, and very low EMC compatibility. This article provides a comprehensive overview of the application fields and working principles of HM2P11PDG3M0N9 backplane connector.

Application Fields of HM2P11PDG3M0N9 Connector

HM2P11PDG3M0N9 connectors have a number of advantages and as such are used in a wide variety of applications. They are designed to be used in high-speed data transfer applications in a variety of communication networks, and they can also be used in storage and High-end Industrial and Avionics Engineers.HM2P11PDG3M0N9 are particularly suited for signal and power connection solutions in mainframes, storage systems, server structures, telecom base station systems, network switching systems, and medical instruments. In the telecom sector, HM2P11PDG3M0N9 are commonly used in large installations such as in Optical Network Units, Fiber Channel Housings, and much more.Thanks to their high power handling, low EMC compatibility, and exceptional signal integrity, HM2P11PDG3M0N9 connectors are well suited for challenging applications that require high reliability and performance. This means that they are often used in mission critical applications where the failure of the connection can have catastrophic consequences.

Working Principle of HM2P11PDG3M0N9 Connector

HM2P11PDG3M0N9 use a combination of several technologies to achieve their high-performance standards. The first technology used is the Hard-Metric™ edge-connector, which provides high-speed, high-performance signal integrity. This technology is used to make sure that high-speed signals can be conveyed reliably over a large array of conductors. In addition, robust contact retention mechanisms are put in place to ensure that the connectors remain securely mated in place for extended periods of time.The second technology used by HM2P11PDG3M0N9 is an adjustable backshell design. This feature ensures that a secure connection can be made in different conditions and in a variety of setups. Furthermore, the adjustable backshell helps to reduce the amount of crosstalk between different traces on the connector, which significantly improves the signal integrity of the connection.Finally, HM2P11PDG3M0N9 have a gold plating and gaskets around the connector pins to ensure excellent EMC compatibility. This makes sure that the signals remain unaffected by outside electromagnetic disturbances.

Conclusion

HM2P11PDG3M0N9 are a highly versatile backplane connector that offers reliable signal and power connection solutions in a variety of applications. The combination of Hard-Metric™ Edge-Connector technology, an adjustable backshell design, and gold plating and gaskets ensure excellent performance in terms of signal integrity, power handling, and EMC compatibility. The wide range of applications of HM2P11PDG3M0N9 is evidence of their overall excellent performance.

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