Allicdata Part #: | HM2P11PDM3R1N9LF-ND |
Manufacturer Part#: |
HM2P11PDM3R1N9LF |
Price: | $ 3.31 |
Product Category: | Connectors, Interconnects |
Manufacturer: | Amphenol FCI |
Short Description: | MPAC 5+2R ST HDR |
More Detail: | 80 (55 + 22 Ground + 3 Power) Position Header, Mal... |
DataSheet: | HM2P11PDM3R1N9LF Datasheet/PDF |
Quantity: | 1000 |
Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
288 +: | $ 3.01445 |
Series: | Millipacs® |
Packaging: | Tray |
Lead Free Status / RoHS Status: | -- |
Part Status: | Active |
Moisture Sensitivity Level (MSL): | -- |
Connector Type: | Header, Male Pins |
Connector Style: | M 11 |
Number of Positions: | 80 (55 + 22 Ground + 3 Power) |
Number of Positions Loaded: | 79 |
Pitch: | 0.079" (2.00mm) |
Number of Rows: | 5 + 2 |
Mounting Type: | Through Hole |
Termination: | Press-Fit |
Connector Usage: | -- |
Contact Finish: | Gold |
Contact Finish Thickness: | 30.0µin (0.76µm) |
Current Rating: | 1.5A |
Voltage Rating: | 750Vrms |
Operating Temperature: | -55°C ~ 125°C |
Features: | Board Guide |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
The HM2P11PDM3R1N9LF is one of the most popular Backplane Connectors in the Hard Metric and Standard categories. This type of connector is known for its superior electrical performance and tight coupling, making it ideal for use in various applications. In this article, we will discuss the application fields and working principles of the HM2P11PDM3R1N9LF.
The HM2P11PDM3R1N9LF is a board-to-board connector specifically designed to provide power and ground connections between printed circuit board assemblies. It can also be used in various applications such as telecommunications, data processing, industrial control, and medical imaging. This type of connector has a positive locking mechanism that ensures a secure connection, keeping it from detaching unless the release latch is manually pressed. This connector is RoHS compliant and meets various other international standards such as IEC 60320-1 and UL478.
With the HM2P11PDM3R1N9LF, users can achieve a contact resistance of less than 50 milliohms and a differential impedance of less than 50 ohms. It also features two columns of dual positions that have a consistent low insertion and withdrawal force which ensures that mating and un-mating are easy, resulting in an improved user experience. In addition, this type of connector has no sharp edges, providing a safe operation.
The HM2P11PDM3R1N9LF is made up of a sturdy zinc alloy body that offers greater resistance to mechanical shock, vibration, and corrosion. The design of the connector allows for multiple configurations and flexible cable routing, enabling users to save space and leverage existing PCB layouts. The connector is fitted with independent shielding to protect signals from interference, making it an ideal choice for applications with high signal integrity requirements.
In terms of working principle, the HM2P11PDM3R1N9LF utilizes a positive latching mechanism and an electromechanical locking device. This locking system provides a strong, yet flexible connection, allowing it to withstand the rigors of frequent use. The connector is also designed with precise mechanical and electrical connection between mated boards, ensuring a reliable signal transmission and low data loss. The dual columns also ensure an extremely tight coupling, reducing the risk of incorrect mating.
The HM2P11PDM3R1N9LF is an excellent choice for a variety of applications, and its superior electrical and mechanical performance makes it a reliable and cost-effective solution for a wide range of applications. It can be used in telecommunications equipment, data processing systems, industrial control panels, audio-visual equipment, medical imaging devices, and more. Its high-performance features make it the perfect connector for any application that requires a secure and precise connection between printed circuit board assemblies.
The specific data is subject to PDF, and the above content is for reference
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