
Allicdata Part #: | HM2P70PK5111GF-ND |
Manufacturer Part#: |
HM2P70PK5111GF |
Price: | $ 0.00 |
Product Category: | Connectors, Interconnects |
Manufacturer: | Amphenol FCI |
Short Description: | MPAC 5R ST PF HDR |
More Detail: | 110 Position Header, Male Pins Connector 0.079" (2... |
DataSheet: | ![]() |
Quantity: | 1000 |
Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
1 +: | 0.00000 |
Series: | Millipacs® |
Packaging: | Tray |
Lead Free Status / RoHS Status: | -- |
Part Status: | Obsolete |
Moisture Sensitivity Level (MSL): | -- |
Connector Type: | Header, Male Pins |
Connector Style: | B 22 |
Number of Positions: | 110 |
Number of Positions Loaded: | All |
Pitch: | 0.079" (2.00mm) |
Number of Rows: | 5 |
Mounting Type: | Through Hole |
Termination: | Press-Fit |
Connector Usage: | -- |
Contact Finish: | Gold |
Contact Finish Thickness: | 30.0µin (0.76µm) |
Current Rating: | 1.5A |
Voltage Rating: | 750Vrms |
Operating Temperature: | -55°C ~ 125°C |
Features: | -- |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Backplane Connectors are used in a variety of applications. These include computer components, data center and telecommunication systems, and medical electronics. The HM2P70PK5111GF is the latest product from HARTING. It is designed to be used in high-speed board-to-board applications, and its features provide for maximum performance and reliability. It is a Hard Metric, Standard product.
The HM2P70PK5111GF is a high-density, high-speed, right angle board-to-board connector. It has a low profile that allows it to fit easily into a component’s chassis. It uses high-speed differential signal transmission and is designed for Gigabit Ethernet, Fast Ethernet, and general data communications. The connector’s design features make it suitable for enclosed and protected board-to-board applications. It has a unique board stacking and nesting feature that ensure users can stack and nest boards as required.
The HM2P70PK5111GF’s contact areas are constructed using robust copper alloy contacts, which provide reliable electrical connections. It provides users with a secure connection and is rated for up to 70 Gbps. The connector also features a five-row/seven-position layout, which allows for more board space to be used for component mounting. It is also designed to be vibration-resistant, which ensures maximum performance in harsh environments.
The HM2P70PK5111GF’s applications are designed for industrial, aerospace, medical, and telecommunications applications. It is designed to meet the most demanding requirements of each application. It is an ideal choice for high-speed board-to-board connections, and its features can increase speed, performance, and accuracy. It is also designed for environmental protection, which can reduce component damage caused by dust, humidity, and other external factors.
The HM2P70PK5111GF’s working principle is simple. It connects two boards and forms a permanent electrical connection between them. The contact areas are designed to ensure maximum electrical conductivity. The contact areas are also protected from forces and vibration, which keeps them secure during operation. The connector is designed to be vibration-resistant, which increases reliability and performance in harsh environments.
The HM2P70PK5111GF is a reliable and durable solution for high-speed, board-to-board data communication. Its high-density design and low profile allow for improved space utilization and increased performance. Its vibration-resistant construction ensures maximum performance in harsh environments, and its robust contact structure provides reliable electrical connections. It is an ideal solution for industrial, aerospace, medical, and telecommunications applications.
The specific data is subject to PDF, and the above content is for reference
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