
Allicdata Part #: | HM2P80PMA3W1GFLF-ND |
Manufacturer Part#: |
HM2P80PMA3W1GFLF |
Price: | $ 1.46 |
Product Category: | Connectors, Interconnects |
Manufacturer: | Amphenol FCI |
Short Description: | MPAC 5R ST PF HDR |
More Detail: | 77 (55 + 22 Ground) Position Header, Male Pins Con... |
DataSheet: | ![]() |
Quantity: | 1000 |
Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
1152 +: | $ 1.33042 |
Series: | Millipacs® |
Packaging: | Tray |
Lead Free Status / RoHS Status: | -- |
Part Status: | Active |
Moisture Sensitivity Level (MSL): | -- |
Connector Type: | Header, Male Pins |
Connector Style: | CR 11 |
Number of Positions: | 77 (55 + 22 Ground) |
Number of Positions Loaded: | All |
Pitch: | 0.079" (2.00mm) |
Number of Rows: | 5 + 2 |
Mounting Type: | Through Hole |
Termination: | Press-Fit |
Connector Usage: | -- |
Contact Finish: | Gold |
Contact Finish Thickness: | 30.0µin (0.76µm) |
Current Rating: | 1.5A |
Voltage Rating: | 750Vrms |
Operating Temperature: | -55°C ~ 125°C |
Features: | Board Guide |
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Hard Metric connectors have become a standardized technology used to provide high reliability connections between printed circuit boards in well-defined backplane architectures. The HM2P80PMA3W1GFLF offers performance that is consistent with the requirements established by applications using the PMOD (Power, Memory, and Data) and FMC (Flexible Mezzanine Card) standards. This connector is compliant with the widely adopted High Speed Backplane Interface (HSBI) standard.
The HM2P80PMA3W1GFLF is a high-performance 80-pin connector with a 2mm pitch, board-to-board mating interface that offers low electrical resistivity and excellent current carrying capability. It has a two-piece design that allows a modular system on board interconnects to be created. The contact has a hard metric pitch and provides a reliable performance over multiple mating cycles. It is built to meet the requirements set forth by high speed differential signal applications.
The HM2P80PMA3W1GFLF uses two different contact technologies, contact-spaced contact and press-fit contact. The contact material is a combination of copper alloy and an elastomer, allowing for a high degree of contact reliability and high cycle life performance. The press-fit contacts are pressed into place in order to provide an electrical connection without an external hardware fastener. The hard metric contacts are spaced farther apart in order to allow for greater performance capabilities.
The HM2P80PMA3W1GFLF provides good electrical and mechanical characteristics to ensure reliable interconnects. The connector has been designed to maintain connection accuracy over multiple mating cycles. It has a high degree of contact surface quality and is rated for IP68 sealing, ensuring a reliable waterproof seal in the most demanding conditions. In addition, the contact design provides a good impedance match between the contact and the printed circuit board.
The working principle of the HM2P80PMA3W1GFLF Backplane Connector is based on an insulation displacement contact. This contact technology uses two or more separate sets of contacts that are spaced apart and insulated from each other. These contacts are arranged in an alternating arrangement, so that one set of contacts can be electrically connected to the other. This feature enables high-speed signal transmission and ensures a reliable connection between the contact and the printed circuit board.
The HM2P80PMA3W1GFLF is suitable for high-speed backplane applications, such as communication systems, industrial control systems, medical equipment, aerospace and defense applications, and consumer electronics. The high speed, low power requirements for these applications make the HM2P80PMA3W1GFLF the ideal choice for these applications. Its performance characteristics allow for the efficient transfer of data without compromising signal integrity.
The HM2P80PMA3W1GFLF is also ideal for use in vibration- and shock-sensitive applications. The contact material offers a good degree of shock and vibration resistance, allowing for reliable performance and low signal attenuation even when subjected to mechanical stresses. Additionally, the connector is constructed to allow for high-frequency signal transmissions and is compatible with a wide range of application protocols.
In conclusion, the HM2P80PMA3W1GFLF is an ideal connector choice for backplane applications. It offers high speed signal performance, excellent mechanical strength, and excellent electrical characteristics. Its two-piece design allows for a modular system on board interconnects, and it is rated for IP68 sealing and has a high degree of contact surface quality. Additionally, the contact is designed to provide a good impedance match between the contact and the printed circuit board.
The specific data is subject to PDF, and the above content is for reference
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