HM2P88PDA111N9LF Allicdata Electronics
Allicdata Part #:

HM2P88PDA111N9LF-ND

Manufacturer Part#:

HM2P88PDA111N9LF

Price: $ 2.62
Product Category:

Connectors, Interconnects

Manufacturer: Amphenol FCI
Short Description: CONN HEADER 200POS TYPE E VERT
More Detail: 250 (200 + 50 Ground) Position Header, Male Pins C...
DataSheet: HM2P88PDA111N9LF datasheetHM2P88PDA111N9LF Datasheet/PDF
Quantity: 1000
Lead Free Status / RoHS Status: Lead free / RoHS Compliant
Moisture Sensitivity Level (MSL): 1 (Unlimited)
768 +: $ 2.38188
Stock 1000Can Ship Immediately
$ 2.62
Specifications
Series: Millipacs®
Packaging: Tray 
Lead Free Status / RoHS Status: --
Part Status: Active
Moisture Sensitivity Level (MSL): --
Connector Type: Header, Male Pins
Connector Style: E 25
Number of Positions: 250 (200 + 50 Ground)
Number of Positions Loaded: 225
Pitch: 0.079" (2.00mm)
Number of Rows: 8 + 2
Mounting Type: Through Hole
Termination: Press-Fit
Connector Usage: --
Contact Finish: Gold
Contact Finish Thickness: 30.0µin (0.76µm)
Current Rating: 1.5A
Voltage Rating: 750Vrms
Operating Temperature: -55°C ~ 125°C
Features: --
Description

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Hard Metric (HM) connectors offer a high speed connection solution for high speed chip-to-chip communication systems. HM2P88PDA111N9LF are much smaller than their accompanying cables and provide a stable and reliable connection in high-density backplane applications. The combination of strong mechanical design and superior mateability characteristics make HM2P88PDA111N9F suitable for high-speed and density data and power transmission.

HM2P88PDA111N9LF connectors belong to the hard metric connector family of backplane connectors. They are designed with accuracy consistency and low signal attenuation. Compared to standard connectors, HM2P88PDA111N9LF offer better isolation and consistency of electrical contacts. This allows for increased signal integrity for higher data rates while providing a robust and reliable connection.

HM2P88PDA111N9LF connectors use a high speed pin configuration in a 2-row interface which provides a reduced form factor and higher density in high speed applications. Moreover, HM2P88PDA111N9F connectors feature an anti-rotation design which helps to maintain the symmetry and consistency of the signal integrity when mated with other HM compatible backplane connectors.

HM2P88PDA111N9LF connectors are designed to meet the requirements of Ethernet, USB 3.0, IEEE 1394, and other high speed applications. They are rated at up to 16 Gbps or 2.1Amp (24V) per mate pair. With a minimum dielectric withstanding voltage of 1000V, they ensure accuracy and stability in very hostile applications. The HM2P88PDA111N9F offers multiple points of contact with its integrated spring loaded female contacts, which reduces contact resistance while increasing retention force and reliability between each contact point.

In terms of mechanical design, hard metric connectors are often designed to reduce the stress on the soldered joints in an application by limiting the number of contacts and by using contact strips rather than individual pins or receptacles. The right angle interface ensures an efficient power and data flow in the system. This design also helps maintain the integrity of the backplane in high shock and vibration environments.

HM2P88PDA111N9LF are designed for high speed and reliability applications in data, telecommunications, networking, and computing. Common applications include signal and power transmission in a variety of backplanes. They are used in a range of applications including Industry 4.0 automation, medical device technology, as well as consumer electronics.

In summary, HM2P88PDA111N9LF backplane connectors provide a reliable and efficient connection solution for high speed chip-to-chip communication systems. The combination of contact strip design and right angle interface ensures accuracy, stability and high signal integrity while also providing a robust and reliable connection. The integrated spring loaded female contacts minimize contact resistance and maximize retention force to provide increased reliability in high shock, vibration, and temperature environments.

The specific data is subject to PDF, and the above content is for reference

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