HM2P89PZJ1P0N9 Allicdata Electronics
Allicdata Part #:

HM2P89PZJ1P0N9-ND

Manufacturer Part#:

HM2P89PZJ1P0N9

Price: $ 0.00
Product Category:

Connectors, Interconnects

Manufacturer: Amphenol FCI
Short Description: MPAC 8R ST PF HDR
More Detail: 88 Position Header, Male Pins Connector 0.079" (2....
DataSheet: HM2P89PZJ1P0N9 datasheetHM2P89PZJ1P0N9 Datasheet/PDF
Quantity: 1000
Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
Moisture Sensitivity Level (MSL): 1 (Unlimited)
1 +: 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Series: Millipacs®
Packaging: Tray 
Lead Free Status / RoHS Status: --
Part Status: Obsolete
Moisture Sensitivity Level (MSL): --
Connector Type: Header, Male Pins
Connector Style: F 11
Number of Positions: 88
Number of Positions Loaded: All
Pitch: 0.079" (2.00mm)
Number of Rows: 8
Mounting Type: Through Hole
Termination: Press-Fit
Connector Usage: --
Contact Finish: --
Contact Finish Thickness: --
Current Rating: 1.5A
Voltage Rating: 750Vrms
Operating Temperature: -55°C ~ 125°C
Features: --
Description

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Backplane connectors are a critical and integral part of any digital or analog communications system, and the type of connector used will dictate performance parameters and features. The HM2P89PZJ1P0N9 backplane connector is a Hard Metric connector used in high-speed applications that require high performance and reliability. In this article, we will discuss the application field and working principle of the HM2P89PZJ1P0N9 Hard Metric connector.One of the major application fields for the HM2P89PZJ1P0N9 is high-speed (20-60 Gb/s) backplane interfaces for computer servers, storage systems, and other communications systems. The HM2P89PZJ1P0N9 is well-suited to meet these requirements because it allows for the highest speeds and most reliable signal transmission. The connector has been designed to provide high-speed performance and durability over a wide range of temperatures and environmental conditions, ensuring that it is well-suited for use in high-performance applications where signal loss and attenuation would have a significant impact on system performance.The HM2P89PZJ1P0N9 Hard Metric backplane connector is a 2-row board-to-board connector that utilizes a double-ended blind mate interface, meaning that pin connections do not need to be aligned or made directly. This design allows for the use of high-density board layouts with up to 64 pins per row and allows for low insertion losses and minimal crosstalk. The contact pins of the HM2P89PZJ1P0N9 are plated with gold and provide excellent electrical performance. The connector has also been designed to be highly reliable, with environmental sealing to the IP67 (ingress protection) level.The working principle of the HM2P89PZJ1P0N9 is based on the double-ended blind mate interface, which utilizes two series of contact pins that are designed to “float” within the connectors. When two boards are connected via the HM2P89PZJ1P0N9 Hard Metric backplane connector, the contact pins on each side of the connector are aligned, allowing for low electrical losses and minimal crosstalk. The double-locking system is also designed to ensure that the adapters are securely in place and that they will not be inadvertently disconnected. The IP67 environmental sealing of the HM2P89PZJ1P0N9 ensures that the connector is suitable for use in harsh environmental conditions, including extreme temperatures, dust, and other contaminants.Overall, the HM2P89PZJ1P0N9 is a reliable, high-performance Hard Metric backplane connector that is ideal for use in high-speed applications such as computer servers, storage systems, and other communications systems. The double-ended blind mate interface allows for high-density board layouts and ensures low insertion losses and minimal crosstalk. The gold-plated pins of the HM2P89PZJ1P0N9 provide excellent electrical performance, and the double-locking system ensures that the connectors remain securely in place. Finally, the IP67 environmental sealing of the connector ensures that it is suitable for use in a wide range of environments.

The specific data is subject to PDF, and the above content is for reference

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