Allicdata Part #: | HM2PN2PNF3U5GFLLF-ND |
Manufacturer Part#: |
HM2PN2PNF3U5GFLLF |
Price: | $ 2.82 |
Product Category: | Connectors, Interconnects |
Manufacturer: | Amphenol FCI |
Short Description: | MPAC 5R ST PF HDR |
More Detail: | 225 (200 + 25 Ground) Position Header, Male Pins C... |
DataSheet: | HM2PN2PNF3U5GFLLF Datasheet/PDF |
Quantity: | 1000 |
Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
1152 +: | $ 2.56486 |
Series: | Millipacs® |
Packaging: | Tray |
Lead Free Status / RoHS Status: | -- |
Part Status: | Active |
Moisture Sensitivity Level (MSL): | -- |
Connector Type: | Header, Male Pins |
Connector Style: | B 25 |
Number of Positions: | 225 (200 + 25 Ground) |
Number of Positions Loaded: | All |
Pitch: | 0.079" (2.00mm) |
Number of Rows: | 5 + 1 |
Mounting Type: | Through Hole |
Termination: | Press-Fit |
Connector Usage: | -- |
Contact Finish: | Gold |
Contact Finish Thickness: | 30.0µin (0.76µm) |
Current Rating: | 1.5A |
Voltage Rating: | 750Vrms |
Operating Temperature: | -55°C ~ 125°C |
Features: | -- |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Backplane connectors are an integral part of any electronic system as they are used to interconnect the board-mounted memories, processors, and other system components to create the backbone of the electronics system. Backplane connectors come in different configurations, made of different materials, and offer varying degrees of electrical performance. These types are classified as either hard metric or standard.
HM2PN2PNF3U5GFLLF is one of the backplane connectors falling in the hard metric category. Hard metric backplane connectors are used when electrical signal integrity is key. These connectors offer superior electrical performance characteristics as they are manufactured with higher precision tolerances when compared to standard connectors. This means that they are better able to preserve an electronic signals integrity from source to destination. They are also more suited for vibration and shock applications such as those commonly found in the aerospace and automotive industries.
HM2PN2PNF3U5GFLLF is designed for use as a pluggable connection for high-speed digital signals in the data, network, and telecommunications systems. It is a durable backplane connector designed for use on printed circuit boards (PCBs) and is suitable for stacking for high densities in slim line designs. It offers superior electrical characteristics and performs over a wide range of frequencies with minimal attenuation. The connector is also designed to meet harsh environmental conditions and high vibration environments.
The HM2PN2PNF3U5GFLLF is composed of an insulated body, which consists of an insulated plastic housing with a molded tongue, two contacts with slotted pin connectors, and a cross-sectional area of 5 mm². The contacts are divided into conductors and routes which form the basis for an electrical connection. The insulated body ensures electrical isolation between the conductors. The slotted pin connectors are used to secure the connector in place on the board and provide a reliable and secure connection.
The working principle of HM2PN2PNF3U5GFLLF begins with a mating procedure in which the plug is inserted into the receptacle. Current passes through the contacts, which are in intimate contact with the plug and receptacle and the electrical path is established. This allows the transmission of electrical signals through the connector without any loss of signal strength or quality.
The HM2PN2PNF3U5GFLLF backplane connector is ideal for applications that require high-speed data transmission, excellent electrical performance, and superior reliability. Its distinguishing feature is its high performance electrical characteristics and robustness that make it suitable for critical applications such as aerospace and automotive. Furthermore, the versatile design of the connector also makes it an attractive choice for applications that require efficient stacking ability and slim designs.
The specific data is subject to PDF, and the above content is for reference
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