HM2R30PA5101N9LF Allicdata Electronics
Allicdata Part #:

HM2R30PA5101N9LF-ND

Manufacturer Part#:

HM2R30PA5101N9LF

Price: $ 1.36
Product Category:

Connectors, Interconnects

Manufacturer: Amphenol FCI
Short Description: CONN RECEPT 55POS TYPE C R/A
More Detail: 55 Position Receptacle, Female Sockets Connector 0...
DataSheet: HM2R30PA5101N9LF datasheetHM2R30PA5101N9LF Datasheet/PDF
Quantity: 1000
Lead Free Status / RoHS Status: Lead free / RoHS Compliant
Moisture Sensitivity Level (MSL): 1 (Unlimited)
576 +: $ 1.23701
Stock 1000Can Ship Immediately
$ 1.36
Specifications
Series: Millipacs®
Packaging: Tray 
Lead Free Status / RoHS Status: --
Part Status: Active
Moisture Sensitivity Level (MSL): --
Connector Type: Receptacle, Female Sockets
Connector Style: C 11
Number of Positions: 55
Number of Positions Loaded: All
Pitch: 0.079" (2.00mm)
Number of Rows: 5
Mounting Type: Through Hole, Right Angle
Termination: Press-Fit
Connector Usage: --
Contact Finish: Gold
Contact Finish Thickness: 30.0µin (0.76µm)
Current Rating: 1.5A
Voltage Rating: 500V
Operating Temperature: -55°C ~ 125°C
Features: Upper and Lower Shield
Description

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Hard metric backplane connectors such as the HM2R30PA5101N9LF are widely used in a variety of high-speed, high-density data transfer and communication applications. This type of backplane connectors are designed specifically to provide a reliable connection between PCB boards and other components in high-speed, high-density applications. The HM2R30PA5101N9LF is a highly reliable hard metric type connector that is capable of providing 1.5 Amps current capacity per contact, while maintaining a tight fixture. It is designed with an ultra-fine gap-tolerance, which is suitable for high-speed connections, and the pins have a 0.40mm pitch spacing.

The Hard Metric HM2R30PA5101N9LF backplane connector utilizes several features to improve the signal integrity between the two mating parts. It features a unique blend of micro-lead and ultrasonic weld bonding technology, which increases the connection reliability and stability. The contacts are all gold-plated for optimal electrical performance, and the connectors are pre-laced for easy and fast installation. The connector also features a reduced signal loss and cross-talk between adjacent pins, reducing signal failure and noise generation.

The working principle of the HM2R30PA5101N9LF backplane connector is based on micro-lead and ultrasonic welding technology. This technology is responsible for providing a strong, reliable connection between the two mating parts. By using these techniques, it is possible to create a highly reliable connection without the need for additional components. The micro-lead welding is used to create a precise electrical connection, while the ultrasonic welding is used to bond the contact pins to the central pin. This ensures a complete, secure connection between the two parts.

The HM2R30PA5101N9LF backplane connector is widely used in high-speed, high-density data transfer and communication applications. This type of connector is also suitable for use in high-end signal transmission and data center applications. This connector is designed to provide superior performance, reliability and flexibility in a wide variety of high-speed applications. The connector is available in a variety of sizes and pin configurations, and is designed to provide optimal electrical performance. In addition, the connector is compliant with European StandardEN 61984, which ensures that the connector adheres to the highest levels of safety.

The specific data is subject to PDF, and the above content is for reference

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