HMTSW-104-23-S-T-LL

Operating Temperature:	-55°C ~ 125°C
Insulation Height:	0.100" (2.54mm)
Contact Shape:	Square
Contact Finish - Mating:	Gold
Contact Finish Thickness - Mating:	30.0µin (0.76µm)
Contact Finish - Post:	Tin
Contact Material:	Phosphor Bronze
Insulation Material:	Liquid Crystal Polymer (LCP)
Features:	--
Overall Contact Length:	0.445" (11.30mm)
Ingress Protection:	--
Material Flammability Rating:	UL94 V-0
Insulation Color:	Natural
Current Rating:	3A
Voltage Rating:	--
Mated Stacking Heights:	--
Contact Finish Thickness - Post:	--
Applications:	--
Number of Positions Loaded:	All
Packaging:	Bulk
Part Status:	Active
Connector Type:	Header
Contact Type:	Male Pin
Pitch - Mating:	0.100" (2.54mm)
Number of Positions:	12
Number of Rows:	3
Row Spacing - Mating:	0.100" (2.54mm)
Series:	Flex Stack, HMTSW
Style:	Board to Board or Cable
Shrouding:	Unshrouded
Mounting Type:	Through Hole
Termination:	Kinked Pin, Solder
Fastening Type:	Push-Pull
Contact Length - Mating:	--
Contact Length - Post:	0.345" (8.76mm)

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Introduction: HMTSW-104-23-S-T-LL products are rectangular connectors that come in the form of headers with male pins that offer an interface for printed circuit boards (PCBs) and wire-to-board connections. These products are designed to address specific application needs, such as signal integration between different product platforms, and are available in a wide range of sizes and performance characteristics.Application Fields: The HMTSW-104-23-S-T-LL can be used in a wide range of application fields. It offers ideal and reliable solutions designed for applications requiring flexible multi-point connectors with low profile mating components.The utmost key factor for selecting the HMTSW-104-23-S-T-LL is its low profile head, which can be used in order to build machines, robots, and other highly compact designs. Additionally, its low profile connectors also reduces the weight of the overall system.The second key factor of using HMTSW-104-23-S-T-LL products is the high reliability. High temperature and difficult environments such as severe vibration or grade A accuracy are also suitable application fields for HMTSW-104-23-S-T-LL products.They can be used in the following application fields including:• Automotive• Aerospace• Robotics• AV Industry• Consumer Electronics• Instrumentation• Industrial• TelecommunicationsWorking Principle: The HMTSW-104-23-S-T-LL rectangular connectors work via contact pin insertion. This means that either a male pin is inserted into a female socket (called pin-in-socket, PiS) or a female pin is inserted into a male socket (called socket-in-pin, SiP). The pin insertion allows a steady electrical connection to be made between the two components.The HMTSW-104-23-S-T-LL rectangular connectors are designed to have a low profile height that is suitable for a range of high-integrity connection applications. It includes a male pin that is inserted into a female socket for improved connection stability. Additionally, the contact pin insertion also ensures improved vibration resistance and better mechanical retention of the connections.The contacts of the rectangular connector is designed in a vee formation along the wire-to-board pathway for optimized contact pressure and reliable connectivity. The vee configuration offers superior shoulder functionality and protects against accidental contact misalignment. Additionally, the vee design also ensures that the contacts are securely fixed even when exposed to extensive shake and vibration.In addition, the HMTSW-104-23-S-T-LL rectangular connectors are designed with a system of plated interlocking retainers which interlock with the female socket to ensure high retention force. This ensures that the electrical connection remains secure and reliable even when exposed to high vibration and shock conditions.Conclusion: HMTSW-104-23-S-T-LL products are rectangular connectors that come in the form of headers with male pins that offer an interface for printed circuit boards (PCBs) and wire-to-board connections. It is designed to offer reliable and durable solutions for applications requiring a low profile, high-integrity connection as a result of its contact pin insertion, low profile height, vee formation along the wire-to-board pathway and system of plated interlocking retainers. It is suitable for a wide range of applications including automotive, robotics, consumer electronics, industrial and telecommunications.

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