HMTSW-111-12-L-Q-225

Operating Temperature:	-55°C ~ 125°C
Insulation Height:	0.100" (2.54mm)
Contact Shape:	Square
Contact Finish - Mating:	Gold
Contact Finish Thickness - Mating:	10.0µin (0.25µm)
Contact Finish - Post:	Tin
Contact Material:	Phosphor Bronze
Insulation Material:	Liquid Crystal Polymer (LCP)
Features:	--
Overall Contact Length:	1.030" (26.16mm)
Ingress Protection:	--
Material Flammability Rating:	UL94 V-0
Insulation Color:	Natural
Current Rating:	3A
Voltage Rating:	--
Mated Stacking Heights:	--
Contact Finish Thickness - Post:	--
Applications:	--
Number of Positions Loaded:	All
Packaging:	Bulk
Part Status:	Active
Connector Type:	Header
Contact Type:	Male Pin
Pitch - Mating:	0.100" (2.54mm)
Number of Positions:	22
Number of Rows:	2
Row Spacing - Mating:	0.200" (5.08mm)
Series:	Flex Stack, HMTSW
Style:	Board to Board or Cable
Shrouding:	Unshrouded
Mounting Type:	Through Hole
Termination:	Solder
Fastening Type:	Push-Pull
Contact Length - Mating:	0.225" (5.72mm)
Contact Length - Post:	0.705" (17.91mm)

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Rectangular Connectors - Headers, Male Pins - HMTSW-111-12-L-Q-225 Application Field and Working Principle

HMTSW-111-12-L-Q-225 headers are widely used in electronic systems to make critical connections between various devices. These connections are used to transfer power, communication signals, and other sensitive information. This particular type of connector is particularly beneficial as it requires minimal space and can provide reliable, secure data transmission when needed. It is important to understand how these connectors work and their respective application fields prior to installation in order to maximize their effectiveness.The HMTSW-111-12-L-Q-225 header is a male pin based multilayer connection system. It requires three parts to create a secure connection: a male pin, a female pin, and a heat sink. The male pin is inserted into the female pin, creating an electrical connection between the two. This connection is made stronger by the addition of a heat sink, which helps to dissipate heat away from the connection point and prevent any damage from occurring due to overheating. In order to create a secure connection, the male pin may need to be soldered to the female pin, or the header may need to be crimped.Due to its important role in data transmissions, the HMTSW-111-12-L-Q-225 header is commonly used in a wide variety of electronics applications, including in smartphones, computers, robotics, and smart home devices. This particular type of connector is beneficial as it is compact enough to fit into even the tightest of spaces, while also providing a secure connection that is resistant to corrosion and mechanical damage.The HMTSW-111-12-L-Q-225 header is designed to be used in a wide variety of applications. It is often found in high-speed communication systems due to its low electrical resistance and tight tolerance. This type of connector is also known for its ability to reduce signal loss and crosstalk, making it an ideal choice for audio, video, and data transmission systems. In addition, the heat dissipation capability of the HMTSW-111-12-L-Q-225 header ensures a reliable connection, protecting against interference and providing better data integrity over longer distances.The HMTSW-111-12-L-Q-225 is relatively easy to install, making it popular for DIY projects as well as for commercial purposes. These connectors can be designed to meet the exact needs of each application, making them suitable for applications as simple as providing connectivity between two electronic components, to those as complex as powering a robotic arm.In summary, the HMTSW-111-12-L-Q-225 header is a popular and reliable connection solution for a variety of electronics applications. It is small enough to fit into even the tightest of spaces and can provide a secure connection that dissipates heat away from the connection point. This type of connector is used in high-speed communication systems, robotics, and smart home devices, and is easy to install, making it suitable for DIY projects as well as for commercial purposes.

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