HMTSW-112-11-G-S-555 Allicdata Electronics
Allicdata Part #:

HMTSW-112-11-G-S-555-ND

Manufacturer Part#:

HMTSW-112-11-G-S-555

Price: $ 1.24
Product Category:

Connectors, Interconnects

Manufacturer: Samtec Inc.
Short Description: MODIFIED .025 SQUARE POST TERMIN
More Detail: Connector Header Through Hole 12 position 0.100" (...
DataSheet: HMTSW-112-11-G-S-555 datasheetHMTSW-112-11-G-S-555 Datasheet/PDF
Quantity: 1000
1 +: $ 1.11510
Stock 1000Can Ship Immediately
$ 1.24
Specifications
Operating Temperature: -55°C ~ 125°C
Insulation Height: 0.100" (2.54mm)
Contact Shape: Square
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Contact Material: Phosphor Bronze
Insulation Material: Liquid Crystal Polymer (LCP)
Features: --
Overall Contact Length: 0.930" (23.62mm)
Ingress Protection: --
Material Flammability Rating: UL94 V-0
Insulation Color: Natural
Current Rating: 3A
Voltage Rating: --
Mated Stacking Heights: --
Contact Finish Thickness - Post: 3.00µin (0.076µm)
Applications: --
Number of Positions Loaded: All
Packaging: Bulk 
Part Status: Active
Connector Type: Header
Contact Type: Male Pin
Pitch - Mating: 0.100" (2.54mm)
Number of Positions: 12
Number of Rows: 1
Row Spacing - Mating: --
Series: Flex Stack, HMTSW
Style: Board to Board or Cable
Shrouding: Unshrouded
Mounting Type: Through Hole
Termination: Solder
Fastening Type: Push-Pull
Contact Length - Mating: 0.555" (14.10mm)
Contact Length - Post: 0.275" (6.99mm)
Description

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Rectangular Connectors - Headers, Male Pins - have become an essential element in the development and manufacture of modern electronic devices. The HMTSW-112-11-G-S-555 is a robust and versatile male header with a highly reliable design and excellent performance characteristics.
The HMTSW-112-11-G-S-555 is a fully encapsulated male header connector. It is designed to provide secure and reliable electrical connections within a range of electronic and electrical systems. It features eight (8) fully shielded contacts (fourteen (14) total pins) from two rows of seven (7) pins each. The header is constructed using a high-quality polyimide material which offers excellent insulation, heat resistance, and flame retardance. The pins are plated with gold to ensure maximum corrosion resistance and durability.
The HMTSW-112-11-G-S-555 is designed to fit many popular rectangular multi-pin connectors. Its low profile design allows it to fit into tight spaces, making it ideal for use in confined areas. Its high-speed transmission capabilities make it suitable for radio frequency (RF) and digital applications. It is also suitable for use in high-temperature environments due to its superior thermal characteristics.
The HMTSW-112-11-G-S-555 is designed for ease-of-use and reliability. The pins are robust and designed to withstand up to 30A (1000V) of current. This connector is suitable for use in high-speed data transfer applications, and its low-resistance contacts ensure minimal signal loss. In addition, the connector features a unique locking mechanism that prevents accidental disconnection. This connector is also designed for maximum reliability and open-circuit protection. The connector features individual contact springs which provide secure locking and maximum stability.
The HMTSW-112-11-G-S-555 is widely used in a variety of electrical and electronic applications. It is widely used in industrial automation, automotive, telecommunications, and many other fields. It is highly suitable for high-speed data transfer in rugged and harsh conditions. Moreover, its small size and remarkably high-performance characteristics make it an ideal choice for use in space-constrained applications.
In conclusion, the HMTSW-112-11-G-S-555 is a high-performance, reliable, and versatile male header connector with robust contacts designed to provide secure and reliable electrical connections. Its highly reliable design, superior thermal characteristics, and small size make it a popular choice for many electrical and electronic applications.

The specific data is subject to PDF, and the above content is for reference

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