Allicdata Part #: | HMTSW-136-21-G-T-1240-ND |
Manufacturer Part#: |
HMTSW-136-21-G-T-1240 |
Price: | $ 10.72 |
Product Category: | Connectors, Interconnects |
Manufacturer: | Samtec Inc. |
Short Description: | MODIFIED .025 SQUARE POST TERMIN |
More Detail: | Connector Header Through Hole 108 position 0.100" ... |
DataSheet: | HMTSW-136-21-G-T-1240 Datasheet/PDF |
Quantity: | 1000 |
1 +: | $ 9.64530 |
Operating Temperature: | -55°C ~ 125°C |
Insulation Height: | 0.100" (2.54mm) |
Contact Shape: | Square |
Contact Finish - Mating: | Gold |
Contact Finish Thickness - Mating: | 10.0µin (0.25µm) |
Contact Finish - Post: | Gold |
Contact Material: | Phosphor Bronze |
Insulation Material: | Liquid Crystal Polymer (LCP) |
Features: | -- |
Overall Contact Length: | 1.430" (36.32mm) |
Ingress Protection: | -- |
Material Flammability Rating: | UL94 V-0 |
Insulation Color: | Natural |
Current Rating: | 3A |
Voltage Rating: | -- |
Mated Stacking Heights: | -- |
Contact Finish Thickness - Post: | 3.00µin (0.076µm) |
Applications: | -- |
Number of Positions Loaded: | All |
Packaging: | Bulk |
Part Status: | Active |
Connector Type: | Header |
Contact Type: | Male Pin |
Pitch - Mating: | 0.100" (2.54mm) |
Number of Positions: | 108 |
Number of Rows: | 3 |
Row Spacing - Mating: | 0.100" (2.54mm) |
Series: | Flex Stack, HMTSW |
Style: | Board to Board or Cable |
Shrouding: | Unshrouded |
Mounting Type: | Through Hole |
Termination: | Solder |
Fastening Type: | Push-Pull |
Contact Length - Mating: | 1.240" (31.50mm) |
Contact Length - Post: | 0.090" (2.29mm) |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
The HMTSW-136-21-G-T-1240 is a type of connector that is increasingly being sought after by users for the countless advantages that it brings in terms of performance, reliability, and convenience. This connector belongs to the family of rectangular connectors known as “Headers, Male Pins” and is specially designed for Board-to-Board applications. The characteristic features of this connector include high-speed signal transmission, high heat dissipation, superior protection against dust, corrosion, and shock and vibration.
In terms of appearance and design, the HMTSW-136-21-G-T-1240 is quite similar to the picture shown here. It includes header and male pins on each side, and has a total of 136 male pins. The pins on the mouthpiece are made of gold-plated brass and have a width of 0.6mm. The material used for the contact face is a combination of polyamide-imide and fiberglass, which provides greater durability to the connector.
The HMTSW-136-21-G-T-1240 is especially useful in applications that require high-speed signal transmission with low power consumption. The connector was designed to provide greater reliability due to its combination of polymer materials, improved heat dissipation capacity, and improved dust and shock protection. It is also compatible with many common board-to-board interface standards, including USB 3.0, MIPI, PCIe, and low-speed LVDS.
The main working principle of the HMTSW-136-21-G-T-1240 connector is based on the concept of electrostatic coupling, where a signal applied to one conductor is transmitted through the other. This is achieved due to the fact that the two objects are electrically coupled. When a signal is applied to one, the other will receive the same signal and transmit it, thus enabling the data to be transmitted between two boards. By using this connection, the data transmission rate is increased, and the signal quality is also improved.
In addition, the HMTSW-136-21-G-T-1240 connector also features an optimized structure that better supports the boards and their components. When compared to other connectors, the HMTSW-136-21-G-T-1240 requires less space and enables easier handling. It also enables easier and faster insertion and removal of the boards, thus increasing the overall productivity.
In conclusion, the HMTSW-136-21-G-T-1240 connector is a very useful piece of equipment for a wide range of board-to-board applications. It features a highly efficient connection system and improved dust, shock, and heat resistance. Furthermore, its optimized structure requires less space and enables easier and faster insertion and removal of the boards. All of these characteristics make it an ideal choice for board-to-board applications that require high-speed signal transmission and increased reliability and performance.
The specific data is subject to PDF, and the above content is for reference
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