HMTSW-144-13-L-Q-225 Allicdata Electronics
Allicdata Part #:

HMTSW-144-13-L-Q-225-ND

Manufacturer Part#:

HMTSW-144-13-L-Q-225

Price: $ 8.44
Product Category:

Connectors, Interconnects

Manufacturer: Samtec Inc.
Short Description: MODIFIED .025 SQUARE POST TERMIN
More Detail: Connector Header Through Hole 88 position 0.100" (...
DataSheet: HMTSW-144-13-L-Q-225 datasheetHMTSW-144-13-L-Q-225 Datasheet/PDF
Quantity: 1000
1 +: $ 7.59780
Stock 1000Can Ship Immediately
$ 8.44
Specifications
Operating Temperature: -55°C ~ 125°C
Insulation Height: 0.100" (2.54mm)
Contact Shape: Square
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Tin
Contact Material: Phosphor Bronze
Insulation Material: Liquid Crystal Polymer (LCP)
Features: --
Overall Contact Length: 1.230" (31.24mm)
Ingress Protection: --
Material Flammability Rating: UL94 V-0
Insulation Color: Natural
Current Rating: 3A
Voltage Rating: --
Mated Stacking Heights: --
Contact Finish Thickness - Post: --
Applications: --
Number of Positions Loaded: All
Packaging: Bulk 
Part Status: Active
Connector Type: Header
Contact Type: Male Pin
Pitch - Mating: 0.100" (2.54mm)
Number of Positions: 88
Number of Rows: 2
Row Spacing - Mating: 0.200" (5.08mm)
Series: Flex Stack, HMTSW
Style: Board to Board or Cable
Shrouding: Unshrouded
Mounting Type: Through Hole
Termination: Solder
Fastening Type: Push-Pull
Contact Length - Mating: 0.225" (5.72mm)
Contact Length - Post: 0.905" (22.99mm)
Description

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HMTSW-144-13-L-Q-225 Application Field and Working PrincipleRectangular connectors, which are also known as headers, male pins, and board-to-board connectors, are connectors which are used in electrical systems. The HMTSW-144-13-L-Q-225 is a specific type of rectangular connector which is designed for use in high-density applications. This article will discuss the application field and working principles of the HMTSW-144-13-L-Q-225.The HMTSW-144-13-L-Q-225 is a type of header connector which is typically used in high-density applications. It is designed to be used in areas with intensive signal density, such as servers, communication systems, computers, and embedded systems. This type of connector is often used when an excessive number of leads must be connected in a limited space. With its design, it allows for high-density applications in electronics without sacrificing signal integrity.The working principle of the HMTSW-144-13-L-Q-225 is similar to that of other rectangular connectors. It is composed of a header, which is typically made of metal, plastic, or a combination of the two. The header is typically preloaded with pins and is connected to a mating socket. The pins are then soldered to the board to provide a secure electrical connection.The HMTSW-144-13-L-Q-225 is designed with high-density applications in mind. Its design is compact and effective and ensures that signal integrity will not be compromised, even when used in high-density applications. The connector is also designed to be easy to install and easy to use.The HMTSW-144-13-L-Q-225 is designed for use in a variety of applications, including but not limited to computers, communication systems, and embedded systems. In addition, it can also be used in automotive and industrial applications, as well as high-density consumer electronics. This makes it a great choice for many different applications.The HMTSW-144-13-L-Q-225 is designed to be a reliable connector, as due to its compact design, it is made to be durable and able to withstand a wide range of temperatures and other environmental conditions. This means that it can be used in a variety of applications without fear of short circuits or bad connections.In conclusion, the HMTSW-144-13-L-Q-225 is a reliable, high-density header connector which is designed for use in a variety of applications. It is designed to be compact and to provide a secure connection, while ensuring that signal integrity is not compromised. This makes it a great choice for a variety of high-density applications, including computers, communication systems, and embedded systems.

The specific data is subject to PDF, and the above content is for reference

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