HMTSW-145-21-S-Q-740 Allicdata Electronics
Allicdata Part #:

HMTSW-145-21-S-Q-740-ND

Manufacturer Part#:

HMTSW-145-21-S-Q-740

Price: $ 12.22
Product Category:

Connectors, Interconnects

Manufacturer: Samtec Inc.
Short Description: MODIFIED .025 SQUARE POST TERMIN
More Detail: Connector Header Through Hole 90 position 0.100" (...
DataSheet: HMTSW-145-21-S-Q-740 datasheetHMTSW-145-21-S-Q-740 Datasheet/PDF
Quantity: 1000
1 +: $ 10.99350
Stock 1000Can Ship Immediately
$ 12.22
Specifications
Series: Flex Stack, HMTSW
Packaging: Bulk 
Part Status: Active
Connector Type: Header
Contact Type: Male Pin
Pitch - Mating: 0.100" (2.54mm)
Number of Positions: 90
Number of Rows: 2
Row Spacing - Mating: 0.200" (5.08mm)
Number of Positions Loaded: All
Style: Board to Board or Cable
Shrouding: Unshrouded
Mounting Type: Through Hole
Termination: Solder
Fastening Type: Push-Pull
Contact Length - Mating: 0.740" (18.80mm)
Contact Length - Post: 0.590" (14.99mm)
Overall Contact Length: 1.430" (36.32mm)
Insulation Height: 0.100" (2.54mm)
Contact Shape: Square
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin
Contact Material: Phosphor Bronze
Insulation Material: Liquid Crystal Polymer (LCP)
Features: --
Operating Temperature: -55°C ~ 125°C
Ingress Protection: --
Material Flammability Rating: UL94 V-0
Insulation Color: Natural
Current Rating: 3A
Voltage Rating: --
Mated Stacking Heights: --
Contact Finish Thickness - Post: --
Applications: --
Description

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The HMTSW-145-21-S-Q-740 is a rectangular connector header with male pins, manufactured in accordance with industry standards. It is a versatile and robust connector that is suitable for a range of applications, and its design also makes it relatively simple to install. As a high-density connector, the HMTSW-145-21-S-Q-740 is designed to improve the signal integrity of your equipment, protecting your valuable electronic components from the damage that can be caused by poor connections.

The HMTSW-145-21-S-Q-740 header is composed of two major components. The first component is the top and bottom housing, which is designed to provide a secure connection between the connector and the mating device. The housing is made from a durable, high-grade plastic that is resistant to chemical corrosion and abrasion, and designed to form a tight seal and withstand a wide range of temperature changes. The second component is the male pins, which are designed to securely retain the mating contact and ensure a stable connection. The male pins are designed for both standard and gold-plated applications, and the gold-plating provides increased performance when carrying high-frequencies signals.

The HMTSW-145-21-S-Q-740 has low contact resistance (100mΩ max) and low insertion force (2.0N max). It is also designed with a hierarchical contact configuration, which allows it to be used with wires of larger cross-sectional area for increased current flow. In addition, it has anti-buckling strain reliefs for improved mechanical performance.

The applications of the HMTSW-145-21-S-Q-740 rectangular connector header with male pins include test and measurement, factory automation, military and aerospace, broadcast and digital signage, and medical technology. The working principle of the HMTSW-145-21-S-Q-740 is relatively simple. When the pins and the header are properly mated, the female contact strips on the mating device make contact with the male pins, and an electrical connection is established. This enables the current to be transferred between the two components, allowing for communication of data or power.

The HMTSW-145-21-S-Q-740 is a reliable and versatile connector that is suitable for a range of applications. Its high-density design allows for improved signal integrity, while its low contact resistance and insertion force ensure better electrical and mechanical performance. With a hierarchical contact configuration and anti-buckling strain relief, the HMTSW-145-21-S-Q-740 is designed to provide a reliable and secure connection and protect your valuable electronic components from damage.

The specific data is subject to PDF, and the above content is for reference

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