HP6-189S-1.27DS(04)

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Backplane Connectors - Hard Metric, Standard are used in various computing and high speed infrastructure applications. The HP6-189S-1.27DS(04) is a great choice for such applications, offering a variety of benefits over other models. This type of connector provides an array of features, including high speed multi-lane support, high power connections, and a thermal design which allows efficient heat dissipation. The following sections discuss the application field and working principle of the HP6-189S-1.27DS(04) in more detail.

Application Field

The HP6-189S-1.27DS(04) is a great choice for backplane applications which require high performance, high speed, and high power connections. It is typically used in telecom, networking, industrial computing, and aerospace systems. The connector is also well suited for use in multilane applications due to its ability to carry multiple lanes of high speed data. The hard metric design of the connector also makes it compatible with other industry-standard hard metric connectors.

Working Principle

The working principle of the HP6-189S-1.27DS(04) is based on its two-tier board Receptacle and Socket design. The Receptacle houses the contacts and the socket carries the PCB. The connector works in a manner in which mechanical force pushes the contacts into the socket, enabling current to flow within the connector. The contact performance of the connector is optimized by attaching a flexible ribbon cable to each side of the socket. This allows each contact to have individualized movement within the socket, helping to reduce cross-talk and ensure solid, durable connections. Additionally, the hard metric design allows for the connector to be used with other industry-standard connectors, enabling designing engineers to easily implement the connector in their designs.

In terms of the thermal design, the HP6-189S-1.27DS(04) has been optimized for optimal thermal dissipation. The contacts have been strategically placed on the board to ensure maximum heat dissipation, helping to ensure long term reliability of the connector. Additionally, the heat dissipation design helps to reduce overall system power consumption. The connector can also be configured with EMI/RFI shielding to further ensure reliability.

Conclusion

The HP6-189S-1.27DS(04) is a great choice for backplane applications requiring high performance, high speed, and high power connections. Its two-tier board Receptacle and Socket design allows for easy implementation, while its hard metric design makes it compatible with other industry-standard connectors. Finally, the connector\'s thermal design enables efficient heat dissipation and reduced system power consumption, making it ideal for a variety of applications.

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