HP6-252S-1.27DS(98) Allicdata Electronics
Allicdata Part #:

HP6-252S-1.27DS(98)-ND

Manufacturer Part#:

HP6-252S-1.27DS(98)

Price: $ 0.00
Product Category:

Connectors, Interconnects

Manufacturer: Hirose Electric Co Ltd
Short Description: CONNECTOR
More Detail: Position Connector
DataSheet: HP6-252S-1.27DS(98) datasheetHP6-252S-1.27DS(98) Datasheet/PDF
Quantity: 1000
Lead Free Status / RoHS Status: Lead free / RoHS Compliant
1 +: 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Series: --
Packaging: --
Lead Free Status / RoHS Status: --
Part Status: Last Time Buy
Connector Type: --
Connector Style: --
Number of Positions: --
Number of Positions Loaded: --
Pitch: --
Number of Rows: --
Mounting Type: --
Termination: --
Connector Usage: --
Contact Finish: --
Contact Finish Thickness: --
Voltage Rating: --
Operating Temperature: --
Features: --
Description

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Backplane Connectors are devices used to connect two or more integrated circuit chips, which are used in the electronic circuitry of any electronic system. The most common types of Backplane Connectors are the Hard Metric, Standard, and HP6-252S-1.27DS(98) applications. Each of these types of Backplane Connectors has a specific application, with the HP6-252S-1.27DS(98) being the one that is primarily used in applications that require extremely high speed data transmission.

The HP6-252S-1.27DS(98) Backplane Connector is designed to provide high-performance and high-speed data transfer over the same backplane connection. It is capable of transferring data at speeds up to 6.5Gbps and is compatible with both SATA and SAS protocols. This Backplane Connector is designed to be used in applications that require high performance, high speed data transmission, and compatibility with multiple protocols. It is also designed to reduce the power consumption of the system while providing reliable data transfer.

The main features of the HP6-252S-1.27DS(98) Backplane Connector include an integrated M12 connector that provides a secure mating surface and high-frequency transmission capabilities. It also features a high-speed data transfer rate of up to 6.5Gbps, along with a low-power control signal and a wide temperature range. Additionally, the HP6-252S-1.27DS(98) Backplane Connector also provides a high-frequency signal integrity of up to 500 MHz.

The primary application field of the HP6-252S-1.27DS(98) Backplane Connector is communications systems. This type of Backplane Connector is well suited for applications that require a high data throughput, such as routers, switches, and storage systems, as well as applications that require reliable data transfer, such as wireless communication systems. The HP6-252S-1.27DS(98) Backplane Connector is also heavily used in industrial applications, where reliable, high-speed data transmission is a must.

The working principle of the HP6-252S-1.27DS(98) Backplane Connector is based on the concept of interconnecting various integrated circuit (IC) chips. This Backplane Connector is designed to provide high-speed data transfer between the IC chips, while also providing a reliable connection between them. The working of the connector involves either a direct connection of the wires of the IC chips to the connector or through an interface board.

The HP6-252S-1.27DS(98) Backplane Connector uses a single-ended signal to achieve its high-speed data transfer rate. This means that a single-ended signal is sent from one IC chip to another, which enables the transfer of data at a faster rate. It can also be used to send and receive digital signals from multiple IC chips simultaneously, allowing for high-speed data transfer without the need for additional connections.

The HP6-252S-1.27DS(98) Backplane Connector is a highly reliable and versatile device that is ideal for applications that require high-speed data transfer. It is designed to reduce the power consumption of the system while also providing reliable data transfer at the same time. The HP6-252S-1.27DS(98) Backplane Connector is designed to be used in a wide variety of different applications, including communications systems, storage systems, and industrial applications.

The specific data is subject to PDF, and the above content is for reference

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